LORD 309-1D
Harmonization Code : 3214.10.00 | Putty and other mastics | Resin cements, caulking compounds and other mastics
Main features
- Non-Sag Vertical Bonding
- 1.5-2 Hour Work Time
- Room- or Heat-Cure Flexibility
Product Description
LORD 309-1D Epoxy Adhesive Component is the blue, thixotropic epoxy resin component used with LORD 309-2D hardener in two-part structural adhesive systems. The resin supports gap filling and non-sag application on vertical surfaces for prepared metals, FRP, wood, and prepared rubber. Mixed-system ratios vary with joint design, while a 54 g mass provides a typical 1.5 to 2 hour working time at 24 deg C and 8 to 16 hours to handling strength. The cured 309-1D/309-2D system develops 37.9 MPa tensile strength, 6% elongation, and a 70 deg C glass transition temperature.
Key features
- Thixotropic Gap Filling: Supports non-sag application on vertical surfaces and gap-filling bondlines.
- Extended Working Time: Provides 1.5 to 2 hours of working time for a 54 g mixed mass at 24 deg C.
- Room- or Heat-Cure Processing: The complete system can cure at room temperature or with applied heat.
Applications
Applications include structural bonding of prepared metals, FRP, wood, and prepared rubber where gap filling or vertical-surface application is required.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Additional Information
Resin component properties
Values apply to LORD 309-1D resin before mixing with LORD 309-2D hardener.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Appearance | Blue paste | LORD 309-1D resin | |
| Viscosity | 300,000 to 1,100,000 | mPa s | 25 deg C |
| Density | 10.5 to 10.8 | lb/gal | 25 deg C |
| Flash point | >93 | deg C | Closed-cup value |
309-1D / 309-2D system properties
System values require LORD 309-2D hardener; the supplier specifies different mix ratios for different joint designs.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Working time | 1.5 to 2 | h | 54 g mixed mass at 24 deg C |
| Handling-strength time | 8 to 16 | h | Room-temperature cure |
| Full-strength development | 24 | h | Bondline maintained at or above 18 deg C |
| Tensile strength | 37.9 | MPa | Cured 309-1D / 309-2D system |
| Elongation at break | 6 | % | Cured 309-1D / 309-2D system |
| Glass transition temperature | 70 | deg C | Cured 309-1D / 309-2D system |
| Service temperature range | -34 to 121 | deg C | Complete bonded system |
