ARALDITE 5864
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- Up to 5 mm Gap Filling
- 16.5 MPa Aluminum Lap Shear
- UL-Recognized 180 deg C Insulation Component
Product Description
ARALDITE® 5864 A/B is a two-component, thixotropic, room-temperature-curing epoxy paste for bonding metals, ceramics, glass-reinforced plastic (GRP) structures and electronic components. The resin and hardener mix 100:50 by weight or volume to form a black paste with a typical 40-minute pot life for a 4 fl oz mass at 25°C. Its non-sag consistency supports gap filling up to 5 mm, while a recommended 0.05–0.10 mm bondline is used where maximum lap shear strength is required. Published data includes typical aluminum lap shear strength of 16.5 MPa after seven days at 25°C, electrical insulation properties, and bonded-joint testing after temperature, humidity, water and chemical exposure. The product is a UL®-recognized system component in the 180°C class for electrical insulation systems.
Key features
- Controlled paste application: Thixotropic, non-sag mixed adhesive fills gaps up to 5 mm and provides a typical 40-minute pot life at 25°C.
- Documented bonded-joint performance: Typical aluminum lap shear strength reaches 16.5 MPa after seven days at 25°C, with additional metal, temperature and environmental exposure data.
- Electrical insulation scope: Published dielectric properties and UL® recognition as a system component in the 180°C electrical insulation class support evaluation for electrical assemblies.
Applications / Suitable for
- Electronic component bonding
- GRP structures and assemblies
- Metal and ceramic bonding where water, chemicals or elevated temperatures may be encountered
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Physical Properties
Additional Information
As-supplied / before-processing properties
Typical resin, hardener and mixed-system data. Values are technical information rather than guaranteed production specifications.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Product form | Two-component thixotropic epoxy paste | — | Room-temperature curing |
| Appearance | Resin A: beige paste; Hardener B: black thixotropic paste; mixed system: black paste | — | Visual |
| Mix ratio | 100:50 (2:1) | parts | Resin A:Hardener B; by weight and by volume |
| Density | Resin A: 1.60; Hardener B: 1.60 | g/cm³ | Typical at 25°C; ASTM D792 |
| Viscosity | Resin A: 70,000; Hardener B: 130,000; mixed system: 90,000 | cP | Typical at 25°C; ASTM D2393 |
| Pot life | 40 | minutes | Typical for a 4 fl oz mixed mass at 25°C; ASTM D2471 |
| Non-sag gap filling | Up to 5 (0.2) | mm (in) | Thixotropic mixed paste |
After-processing / final-state properties
Typical cured-adhesive and bonded-joint data under the stated cure, substrate and test conditions. These values are not universal design allowables.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Lap shear strength | 16.5 (2400) | MPa (psi) | Typical; aluminum lap joint; cure 7 days at 25°C; DIN 53283 |
| Lap shear strength with post-cure | 17.9 (2600) | MPa (psi) | Typical; aluminum lap joint; cure 24 h at 25°C plus 30 min at 80°C; DIN 53283 |
| Lap shear strength on stainless steel | 22 (3200) | MPa (psi) | Typical; 1.0 mm stainless steel; cure 16 h at 40°C; DIN 53283 |
| Glass transition temperature, Tg | 110 (230) | °C (°F) | Typical; DMA; ASTM D4065 |
| Hardness | 84 | Shore D | Typical cured adhesive |
| Roller peel | 3 (17) | N/mm (pli) | Typical; ISO 4578 |
| Dielectric strength | 440 | V/mil | Typical electrical property |
| Volume resistivity | 6.1 × 1015 | Ω·cm | Typical electrical property |
