3M™ Scotch-Weld™ Structural Adhesive Film AF 163-2
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- Preformed Epoxy Film
- Multiple Product Configurations
- Vacuum Curing Capability
Product Description
3M™ Scotch-Weld™ Structural Adhesive Film AF 163-2 is a thermosetting modified epoxy structural adhesive film available in multiple weights and supported or unsupported constructions. It is intended for structural bonding in solid-panel and honeycomb sandwich assemblies. The film combines high fracture toughness and peel strength with bond performance across temperatures from -67°F to 250°F (-55°C to 121°C). It can be processed using positive-pressure or controlled vacuum-curing methods and is available with knit, non-woven, fiberglass-scrim, one-side-tacky, and unsupported constructions to accommodate different assembly requirements.
Key features
- Structural epoxy film: Thermosetting modified epoxy chemistry provides a controlled, preformed adhesive layer for structural bonding.
- Broad construction selection: Available in multiple nominal weights, thicknesses, colors, and carrier configurations, including unsupported film.
- Flexible cure processing: Supports positive-pressure bonding and controlled vacuum-curing techniques, with documented short cure schedules from 225°F to 300°F.
Applications / Suitable for
- Solid-panel structural bonding
- Honeycomb sandwich constructions
- Metal-to-metal structural assemblies
- Metal-to-honeycomb structural assemblies
TDS, SDS & Technical Documents
Technical Specifications
Thermal Properties
Electrical Properties
Additional Information
As-supplied / before-processing properties
Available constructions and dimensions vary by AF 163-2 product designation. Values are nominal unless otherwise stated.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Product form | Structural adhesive film | — | As supplied |
| Adhesive chemistry | Thermosetting modified epoxy | — | Product family description |
| Available constructions | Fiberglass scrim, knit carrier, light non-woven carrier, non-woven carrier, one-side-tacky non-woven carrier, or unsupported | — | Varies by product designation |
| Available nominal film weights | 0.015, 0.030, 0.045, 0.060, 0.085, or 0.100 | lb/ft² | Nominal; availability depends on construction |
| Available nominal thicknesses | 2.5, 5.5, 7.5, 9.5, 13, or 16 | mil | Nominal; availability depends on construction and film weight |
| Recommended storage temperature | 0 or below | °F | Recommended for maximum storage life |
| Shelf life | 12 | months | From date of shipment in the original unopened container at 0°F or below |
After-processing / final-state properties
Typical cured-film properties are representative laboratory values and are not intended for specification purposes. Cure and test conditions are preserved below.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Ultimate tensile strength | 7,000 | psi | ASTM D638; unsupported free film; tested at 75°F; cured 60 minutes at 250°F |
| Tensile modulus | 1.6 × 105 | psi | ASTM D638; unsupported free film; tested at 75°F; cured 60 minutes at 250°F |
| Glass-transition temperature, dry | 226 (108) | °F (°C) | DuPont 1090 DMA; 5°C/min ramp; cured 90 minutes at 235°F |
| Glass-transition temperature, wet | 180 (82) | °F (°C) | DuPont 1090 DMA; after 14 days in 70°C water; 5°C/min ramp; cured 90 minutes at 235°F |
| Thermal conductivity at 43°C | 0.096 | Btu·ft/(ft²·hr·°F) | ASTM C177; cured 90 minutes at 235°F |
| Coefficient of thermal expansion | 90 × 10-6 | in/in/°C | TMA; -30°C to 50°C; 5°C/min; cured 90 minutes at 235°F |
| Volume resistivity | 4.4 × 1014 | ohm·cm | ASTM D257; cured 90 minutes at 235°F |
| Dielectric strength | 1,800 | V/mil | ASTM D149; 1 kHz at 75°F (23°C); cured 90 minutes at 235°F |
