3M 3024
Harmonization Code : 3907.30.00.40 | Epoxy Mold Compounds containing by weight more than 70 % silicon dioxide
Main features
- High Honeycomb-Gap Expansion
- Flexible 121-176 deg C Cure
- Low-Sag Core Splicing
Product Description
3M Scotch-Weld Structural Core Splice Film AF 3024 is an off-white, unsupported epoxy adhesive film that expands during heat cure to splice, reinforce, and fill mismatched honeycomb core. Its typical 2.4 to 2.6 expansion ratio develops across the three film variants, while low sag helps the material remain positioned as it fills the joint. The film cures from 250 to 350 deg F (121 to 176 deg C) and reaches full expansion at heat-up rates as low as 0.5 deg F/min. Low volatile loss and a cured density of 0.37 to 0.40 g/cc support aerospace core-splice processing where controlled expansion and reduced mass are important.
Key features
- High core-gap expansion: Typical expansion reaches 2.4 to 2.6 times the original film thickness under the listed cure conditions.
- Flexible heat-cure range: The epoxy film cures from 250 to 350 deg F (121 to 176 deg C).
- Low-sag cure behavior: Controlled sag supports honeycomb splicing and mismatch filling during thermal processing.
Applications
Suitable for filling mismatch areas, reinforcing and splicing honeycomb core, and aerospace sandwich structures.
TDS, SDS & Technical Documents
Technical Specifications
No specifications available.
Additional Information
As-supplied / before-processing properties
Values are representative or typical and are not specification limits.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Color | Off-white | - | Typical; 25, 50, and 100 mil variants |
| Base | Epoxy | - | As supplied |
| Form | Unsupported film | - | As supplied |
| Nominal thickness | 25 +/- 5; 50 +/- 5; 100 +/- 10 | mil | Variant-specific |
| Approximate areal weight | 0.13; 0.25; 0.5 | lb/ft^2 | 25; 50; 100 mil variants |
| Approximate uncured density | 60 (0.96) | lb/ft^3 (g/cc) | Typical |
| Shelf life | 6 | months | From 3M shipment at 0 deg F (-18 deg C) or lower |
Final-state / after-processing properties
Cured values are typical; cure conditions are shown in each row.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Expansion ratio | 2.4 to 2.5 / 2.5 to 2.6 | - | Typical; 250 deg F (121 deg C) / 350 deg F (176 deg C) cure |
| Cured density | 23 to 25 (0.37 to 0.40) | lb/ft^3 (g/cc) | Typical; free film |
| Volatile content | Less than 1 / less than 1.5 | % | 250 deg F for 90 min / 350 deg F for 60 min |
| Sag or slump | 0.25 (0.6) / 0.375 (1) | in (cm) | Typical; 250 deg F / 350 deg F cure for 90 min |
| Operating-temperature range | -67 to 350 (-55 to 176) | deg F (deg C) | Cured performance range |
