TGP 8000PT | Thermal Putty Pad
Harmonization Code : 3824.99.96.99 | Prepared binders for foundry moulds or cores; chemical products and preparations of the chemical or allied industries (including those consisting of mixtures of natural products), not elsewhere specified or included : Other : Other: Other
Main features
- 0.19 Thermal Impedance
- 8.0 Thermal Conductivity
- 0.5 - 5 mm Thickness
Product Description
Honeywell TGP 8000PT Thermally Conductive Putty Pads provide high thermal performance and excellent thermal reliability (8 W/mK). The material’s putty-like design enables excellent gap-filling capability for applications with large dimensional variances within surfaces. Special surface reinforcement enables easier handling for operators during high volume assembly. Pads thicker than 0.5mm come contained and reinforced within single sided fiber glass and dual liners.
Honeywell TGP 8000PT is naturally tacky and requires no additional adhesive to mate to heat source and heat sink. This product can be used for unbalanced mounting pressure applications while also improving dripping and pump out, compared to thermal grease. It is available in thicknesses ranging from 1.0mm to 5.0mm. With 10~70% compression, the final BLT could reach a minimum of 0.5mm.
Learn more When should you choose thermal putty pad over thermal gap pad and thermal gel.
Available Versions:
- TGP8000PT-01, single-side fiberglass reinforced version; (increased tackiness to the heatsink surface and recommended for small size application)
- TGP8000PT-00, no fiberglass reinforced version
- Properties customization possible (compression-deflection, breakdown voltage)
- Die-cut shapes possible
Key Features:
- Low thermal impedance and UL94 V-0 listed
- BLT (bond line thickness) from 1mm to 5mm
- Natural tacky to the heatsink and heat source
- Ultra-soft (shore00, 5) with high compressibility and low stress generated
- Suitable for applications with large dimensional variances
- Minimum bleeding and pump out controlled
Highly Recommend For:
- Automotive/consumer electronics, PCB
- Power device & modules
- Telecommunications & network servers
- Semiconductors logics & memory
- EV battery & charging station
SOLSTICE TGP8000PT
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
Shipping in 16 weeksTDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Additional Information
Thermal putty pad VS. thermal gap pad
Thermal putty pads and thermal gap pad are similar products. For example, TGP8000 and TGP8000PT both have high thermal conductivity as 8 W/m.K and need at least 10% compression while applying. The main difference is that thermal putty pads are ultra-soft and could be compressed up to 90%. It almost has no tensile strength and no elasticity, thus will not recover and bounce back. Due to the low stress and high compressibility, thermal putty pads are more suitable for applications with large dimensional variances, comparing with traditional thermal gap pad.
Thermal putty pad VS. thermal hybrid gel
Both thermal putty pad and thermal hybrid gel belongs to gap filler type TIM, which are applicable for large bone line thickness application (>0.5mm). Thermal gel products are designed for automation process such as dispensing. Compared with hybrid gels, putty pads are suitable for large area assembly. It is easy to apply thermal putty pads manually and there is no needs for dispensing equipment.
TGP8000PT Thermal Performance
Shelf Life: 12 months at 23±2˚C
Thickness range: 1.0-5.0mm with 0.25mm incremental
Thickness Tolerance: >=1mm, ±10%, 0.5-1mm, ±0.1mm
