TGP 6000 | Thermal Gap Pad

Harmonization Code : 3824.99.96.99 | Prepared binders for foundry moulds or cores; chemical products and preparations of the chemical or allied industries (including those consisting of mixtures of natural products), not elsewhere specified or included : Other : Other: Other

TGP6000 | Thermal Gap Pad

Main features

  • 0.25 Thermal Impedance
  • 6.0 Thermal Conductivity
  • Excellent surface wetting

Product Description

Honeywell's TGP6000 Thermal Gap Pads (TGP) exhibit exquisite thermal and electrical properties.With a Thermal conductivity of 6 W/mK and a Dielectric constant of 8.5 they are designed to minimize thermal resistance at interfaces, and maintain excellent electrical performance through extensive reliability testing. They have excellent surface wetting designed for low contact resistance.

Honeywell's TGP6000 is naturally tacky, and requires no additional adhesive which could inhibit thermal performance. 

 

Thickness range:

  • 0.5-5.0mm with 0.25mm incremental

Thickness Tolerance: >1mm, ±10%

  • 0.5-1mm, ±0.1mm
  • <0.5mm, ±0.05mm

 

Product Family

SOLSTICE TGP6000

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Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.

Product availability
EU Shipping in 16 weeks
TDS, SDS & Technical Documents

Technical Specifications

General Properties
ColorColor
Grey
Film ThicknessFilm Thickness
0.5 - 5 mm
Specific GravitySpecific Gravity
3.3
Thermal Properties
Thermal ConductivityThermal Conductivity
6.0 W/m.K
Thermal ImpedanceThermal Impedance
0.25 °C·cm²/W
UL 94 RatingUL 94 Rating
V-0
Electrical Properties
Volume ResistivityVolume Resistivity
3800000000000000 Ohms⋅cm

Additional Information

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