TG1500I | Thermal Grease
Harmonization Code : 3824.99.96.99 | Prepared binders for foundry moulds or cores; chemical products and preparations of the chemical or allied industries (including those consisting of mixtures of natural products), not elsewhere specified or included : Other : Other: Other
Main features
- 0.03 Thermal Impedance
- 1.5 Thermal Conductivity
- 30μm BLT
Product Description
TG1500I Thermal Silicone Grease offers a thermal conductivity of 1.5 W/mK and a controlled bond line thickness of 30 micron @35psi, 50oC. Its viscosity and excellent thixotropy make it fit for large–scale production with dispensing, screen printing and stencil printing. It is an excellent, option for thermally demanding applications that can support a >30um BLT.
TG1500I is used for applications with high power density requirements. It provides superior thermal performance with ease of use across a multitude of applications. It is a stable homogeneous mixture under room temperature with an operating temperature range of -40oC to 150oC. Please note that this thermal grease contains solvent and requires a drying step.
Product Key Features:
- Low thermal resistance (0.021°C-in²/W at 50 psi) — effectively address overheating and reliability issues
- Maintains high reliability and performance across demanding environments and applications
- Suitable for use in pneumatic dispensing and screen printing systems, supporting automated and high-volume manufacturing
Applications
- Heat dissipation from heat-generating components (like CPUs and GPUs) to cooling solutions (like heat sinks).
SOLSTICE TG1500I
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
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