PCM 45F | Phase Change Pad
Harmonization Code : 8547.90.00.00 | Insulating fittings for electrical machines, appliances or equipment, being fittings wholly of insulating material apart from any minor components of metal (for example, threaded sockets) incorporated during moulding solely for purposes of assembly, other than insulators of heading 8546; electrical conduit tubing and joints therefor, of base metal


Main features
- 0.09 - 0.12 Thermal Impedance
- 2.0 - 2.5 Thermal Conductivity
- Pad form
Product Description
PCM45F is Honeywell's thermally conductive phase change pad. It is designed to minimize thermal resistance at interfaces and maintain extremely stable performance through reliability testing required for long product life applications. In addition to that it has excellent electrical properties and very high volume resistivity.
PCM45F has a Thermal conductivity of 2.0 - 2.5 (W/m·K) depending on the bondline thickness and is based on a robust polymer PCM structure that exhibits excellent wetting properties during typical operating temperature ranges, resulting in very low surface contact resistance. The proprietary material provides superior reliability and maintains low thermal impedance (0.09-0.12) , making it desirable for high-performance integrated circuit devices.
Technical Specifications
General Properties
Specific GravitySpecific Gravity
2.2Thickness rangeThickness range
0.20 - 1.00 mmThermal Properties
Thermal ConductivityThermal Conductivity
2.0 - 2.5 W/m.KThermal ImpedanceThermal Impedance
0.09 - 0.12 °C·cm²/WElectrical Properties
Volume ResistivityVolume Resistivity
820000000000000 Ohms⋅cmAdditional Information
When choosing a printable paste it is important to understand the process parameters and limitations.
That's why we ask, when you contact us, to include the following information:
- What is your print thickness?
- How long is your printing time and working window?
- What is your drying step after printing?
- Temperature (Room temperature or something else?)
- Time
- Do you have any viscosity limitations in the printing process?





















