SACX Plus 0807
Harmonization Code : 8001.20 | Unwrought tin: Tin alloys
Main features
- Low-Silver, Lead-Free Alloy
- 216 to 225 deg C Solidus-Liquidus Range
- Vaculoy Oxide-Reduction Processing
Product Description
ALPHA® SACX® Plus 0807 Lead-Free Solder Alloy is a low-silver, lead-free solder alloy formulated with proprietary additives for wave and selective soldering. It has a solidus temperature of 216°C and a liquidus peak of 225°C, supporting use with many established lead-free wave-soldering temperature profiles. The alloy is produced using the proprietary Vaculoy® process to remove certain impurities, particularly included oxides. SACX Plus 0807 is available in multiple forms for production, replenishment, and rework requirements. :contentReference[oaicite:0]{index=0}
Key features
- Low-silver lead-free alloy: Provides a lower-silver alternative to SAC305 for lead-free electronics soldering processes.
- 216–225°C melting range: Combines a 216°C solidus with a 225°C liquidus peak for compatibility with many existing lead-free wave-soldering profiles.
- Vaculoy® processing: Proprietary alloy production removes certain included impurities, particularly oxides associated with solder viscosity and dross formation.
Applications / Suitable for
- Lead-free wave soldering
- Selective soldering
- Single- and double-sided printed circuit boards
- Assemblies using OSP pad finishes, including boards exposed to prior reflow excursions
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Mechanical Properties
Additional Information
As-supplied / before-processing properties
Typical physical and melting properties of ALPHA SACX Plus 0807 lead-free solder alloy. :contentReference[oaicite:1]{index=1}
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Alloy type | Low-silver, lead-free solder alloy | — | SACX Plus 0807 |
| Solidus | 216 | °C | Differential scanning calorimetry |
| Liquidus peak | 225 | °C | Cooling curve |
| Density | 7.4 | g/cm³ | Calculated |
| Spread factor | >75 | % | JIS Z 3197 |
| Maximum lead content | 0.07 | % | Standard SACX Plus 0807 alloy specification |
After-processing / final-state properties
Typical properties measured on solid bulk-alloy specimens under the stated conditions; values do not represent guaranteed solder-joint or assembly-level performance. :contentReference[oaicite:2]{index=2}
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Electrical resistivity | 0.1399 | µΩ·m | Measured resistance of solid wire at 22°C |
| Coefficient of thermal expansion | 19.5 × 10−6 | /°C | 30–100°C at 1°C/minute |
| Coefficient of thermal expansion | 20.2 × 10−6 | /°C | 100–180°C at 1°C/minute |
| Vickers hardness | 16.4 | HV | As-cast alloy |
| Tensile strength | 30.7 | MPa | Strain rate 10−3/second |
| Elongation | 21.0 | % | Strain rate 10−3/second |
| Creep strength | >1,000 | hours | 400 g/mm² load at 100°C |
