LINQBOND UF3803 | Flip chip epoxy Underfill
Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
- Solvent free
- Low viscosity
- Low CTE a1 (25 ppm)
Product Description
LINQBOND UF3803
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
Shipping in 16 weeks
Shipping in 16 weeks
Shipping in 16 weeksTDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Physical Properties
Additional Information
Instructions for Use:
- Before use, thaw the product at room temperature for 2–3 hours. Ensure the syringe is placed vertically during thawing. Keep the container airtight until it reaches room temperature.
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Ensure the surface to be bonded is clean and free of contaminants.
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Cure time may vary based on the actual part geometry, material volume, and equipment. It is recommended that the test be done on actual parts and equipment.
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For large-scale applications, consider a staged curing process: start with a lower temperature pre-cure, followed by a full cure at a higher temperature to effectively manage heat release.
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Cool down gradually after curing to minimize thermal stress.
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The epoxy cannot be refrozen once exposed to room temperature.
Rate of reaction at different temperatures
Storage and Handling
Store and transport below -5°C Temperature. Keep away from moisture and heat sources. It is strictly not allowed to be stored in outdoor environments.
