LINQBOND UF-1170 | Liquid Epoxy Underfill for BGA/CSP
Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
- Single component
- Excellent heat and moisture resistance
- Automotive grade
Product Description
LINQBOND UF-1170 is a one-component epoxy adhesive with exceptional heat resistance, dielectric properties, and electrical insulation, making UF1170 ideal for demanding underfill applications in semiconductor packaging, BGA/CSP solder joints, high-temperature electronic devices, automotive electronics, and 5G equipment.
LINQBOND UF-1170 offers robust protection against mechanical stress, moisture, and thermal cycling, ensuring long-term reliability and durability.
Cure Conditions
- 30 mins @150℃
Applications
- Underfill for BGA/CSP solder joints
- Semiconductor packaging and encapsulation
- Automotive electronic modules
- High-performance electronics and 5G equipment
- Assemblies exposed to high temperature or thermal cycling
LINQBOND UF-1170
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
Shipping in 12 weeks
Shipping in 12 weeks
Shipping in 12 weeksTechnical Specifications
General Properties
Thermal Properties
Electrical Properties
Chemical Properties
Physical Properties
Additional Information
Thawing & Usage
- Thaw material at room temperature (14–34 °C) for 1–2 hours before use. Do not open the container until it reaches room temperature to avoid condensation.
- Keep the container upright during thawing; do not re-freeze.
- Use within 2 days after opening.
- Preheating the PCB to 70–80 °C can enhance flowability.
Flow conditions
FR4(Substrate)+Glass, Gap100μm
