LINQBOND LB-FL501 | Fill encapsulant
Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
- Fill
- Low CTE a1: 23 ppm/°C
- Easily flow, low viscosity
Product Description
LINQBOND LB-FL501 is a high-performance, one-component fill epoxy encapsulant specifically designed for demanding semiconductor applications. Formulated with a low thermal expansion coefficient (CTE1: 23.2 ppm/°C, CTE2: 76.6 ppm/°C), LB-FL501 provides exceptional thermal stability and protects sensitive components from mechanical stress and environmental factors. Its excellent operability combined with a viscosity of 37,000 cps at 25°C ensures easy handling and precise dispensing, while its strong adhesion and chemical resistance contribute to the overall reliability of electronic assemblies.
LINQBOND LB-FL501 epoxy encapsulant offers superior resistance to a wide range of chemicals and solvents, safeguarding components from degradation. Additionally, LB-FL501 exhibits outstanding heat shock resistance, making it suitable for applications that experience rapid temperature fluctuations. Typical applications include IC memory cards, chip carriers, hybrid circuits, chip-on-board, multi-chip modules, BGA, and pin grid arrays. It comes in 5, 10, 30 and 50cc syringes.
Cure Schedule
- 30 minutes @ 135°C plus 90 minutes @ 175°C
LINQBOND LB-FL501
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