EMC-G836 | Epoxy Molding Compound
Harmonization Code : 3907.30.00.40 | Epoxy Mold Compounds containing by weight more than 70 % silicon dioxide
Main features
- For QFN & QFP packages
- Meets JEDEC MSL 3 reliability requirements
- High spiral flow
Product Description
LINQSOL EMC-G836 is a halogen-free epoxy molding compound engineered for the precise encapsulation of a wide range of semiconductor packages, including Quad Flat No-Leads (QFN), Quad Flat Packages (QFP), and other thin, high-density packages like BGA TF cards (microSD). Its design focuses on delivering both superior performance and exceptional reliability.
Product Key Features
- Wide gel time (36s) — offers a broader processing window, ideal for QFN and QFP molding applications.
- High spiral flow (149cm) — meets demanding flowability requirements for intricate package designs.
- Low water absorption
- RoHS and REACH compliant
Applications
- Encapsulation of quad flat no-leads (QFN) & quad flat packages (QFP)
- Encapsulation of thin, high-density packages, including BGA TF cards (microSD)
LINQ EMC-G836
1. Select Pellet Size
2. Select Pellet Weight
Catalog Product
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
Product availability 
Shipping in 12 weeks
Shipping in 12 weeks
Shipping in 12 weeks
Shipping in 12 weeks Shipping in 12 weeks Shipping in 12 weeksTDS, SDS & Technical Documents
Technical Specifications
General Properties
Specific GravitySpecific Gravity
2Physical Properties
Spiral Flow @ 175°CSpiral Flow @ 175°C
149 cmViscosityViscosity
18000 mPa.sThermal Properties
Glass Transition Temperature (Tg)Glass Transition Temperature (Tg)
120 °CThermal ConductivityThermal Conductivity
0.92 W/m.KUL 94 RatingUL 94 Rating
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