EMC-G194 | Black Epoxy Molding Compound

Main features

Good moldability
Low stress
High adhesion

Product Description

LINQSOL EMC-G194 is a green epoxy molding compound engineered for use in rectifier diodes, SMX, TO, and DIP semiconductor packages. It is designed for efficient, high-volume molding operations with excellent flow and low internal stress. This makes it ideal for devices with complex shapes or rigorous process requirements. EMC-G194 has high adhesion strength on leadframes, copper, and other common substrate materials, reducing delamination risks and ensuring mechanical stability during thermal cycling and high-temperature operation.

LINQSOL EMC-G194 delivers high performance and reliability while meeting EU RoHS requirements and REACH Substances of Very High Concern (SVHC) restrictions. EMC-G194 seamlessly integrates advanced material properties, safety compliance, and superior performance for reliable semiconductor encapsulation.

Product Key Features:

Optimized Rheology for Enhanced Moldability: Allows for complete cavity fill, minimal wire sweep, and reduced void formation
Low Stress Formulation: Minimizes stress exerted on the encapsulated die and bond wires during thermal cycling, significantly reducing the risk of delamination, die cracking, and bond wire deformation.
High Adhesion for Robust Encapsulation: Crucial for preventing moisture ingress and delamination, which are primary failure mechanisms in encapsulated devices. The strong bond integrity ensures long-term protection against environmental factors and mechanical stresses.

LINQSOL EMC-G194 is available in custom pellet dimensions. Contact us for more information.

TDS, SDS & Technical Documents

TDS_LINQSOL EMC-G194

English (Technical Data Sheet (TDS))

Technical Specifications

General Properties

Filler Size Cut

150 µm

Specific Gravity

1.82

Thermal Properties

Glass Transition Temperature (Tg)

175 °C

Chemical Properties

Water Absorption

0.44 %

Additional Information

Processing Instructions

Before use, let LINQSOL EMC-G194 reach room temperature (23±5 °C) for 24 hours. Keep the bag unopened and stored in a dry location with a relative humidity of ≤50% during thawing to prevent moisture contamination.
Use the materials within 72 hours after removing the container from cold storage.

Storage and Handling

LINQSOL EMC-G194 is available in pressed pellets in a wide range of sizes to meet specific customer needs. To ensure product integrity, keep it away from oxidizing materials. For long-term storage, maintain a cold environment. The shelf life when stored below 5 °C is 183 days.