LAIRD TPCM7125
Harmonization Code : 3824.99.92.97 | Prepared binders for foundry molds or cores; chemical products and preparations of the chemical or allied industries (including those consisting of mixtures of natural products), not elsewhere specified or included: other : other : other
Main features
- 0.125 mm Phase-Change Film
- 7.5 W/m-K Bulk Conductivity
- 25 Micrometer Minimum Bondline
Product Description
Tpcm 7125 Phase Change Thermal Interface Material is a 0.125 mm free-standing, non-silicone thermoplastic film for thin, pressure-activated electronic thermal interfaces. Its 7.5 W/(m K) bulk thermal conductivity and 25 micrometer minimum bondline capability support low-resistance contact after the material softens and wets the mating surfaces. The Tpcm 7000 matrix is naturally tacky for controlled liner handling and is formulated to resist pump-out during thermal cycling. The 7125 configuration is available as sheets or converted die cuts for assembly integration. Applications include graphics cards, desktop and notebook computers, servers, IGBTs, power converters, gaming systems, automotive electronics, and memory modules.
Key features
- 0.125 mm Phase-Change Film: The Tpcm 7125 configuration provides a thin, free-standing interface for controlled placement.
- 7.5 W/(m K) Bulk Conductivity: The filled non-silicone thermoplastic supports high heat transfer through the bondline.
- 25 Micrometer Minimum Bondline: Heat and pressure allow the material to wet surfaces and reduce installed thickness.
Applications / Suitable for
- Graphics cards and desktop computers
- Notebook computers and servers
- IGBTs and power converters
- Gaming systems and automotive electronics
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Additional Information
As-supplied / before-processing properties
Exact as-supplied properties for the 0.125 mm Tpcm 7125 configuration.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Construction | Free-standing filled non-silicone thermoplastic | Phase-change film | |
| Color | Grey | Visual | |
| Nominal thickness | 0.125 | mm | with a tolerance of 0.025 mm |
| Density | 2.5 | g/cc | Helium pycnometer |
| Storage temperature | 0 to 40 | deg C | Sealed bag; no humidity requirement |
| Shelf life | 1 | year from shipment | Sealed bag |
After-processing / final-state properties
Typical installed phase-change properties for Tpcm 7125 at the stated pressure and temperature conditions.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Bulk thermal conductivity | 7.5 | W/(m K) | Hot Disk |
| Thermal resistance | 0.10 / 0.06 | C-cm^2/W | 10 psi / 50 psi at 70 deg C; ASTM D5470 |
| Operating temperature range | -40 to 125 | deg C | Laird test method |
| Burn-in condition | at least 60 | deg C | Heatsink side; more than 3 minutes and more than 25 psi |
| Minimum bondline thickness | 25 | micrometers | Laird test method |
| Dielectric constant | 31.54 | 1 MHz; ASTM D150 | |
| Volume resistivity | 5.4 x 10^15 | ohm cm | ASTM D991 |
| Flammability | V-0 | UL 94 |
