LAIRD TFLEX SF10
Harmonization Code : 3824.99.92.97 | Prepared binders for foundry molds or cores; chemical products and preparations of the chemical or allied industries (including those consisting of mixtures of natural products), not elsewhere specified or included: other : other : other
Main features
- 10 W/m-K Non-Silicone Interface
- Low-Pressure Thermal Contact
- 0.3 to 5.0 mm Sheet Range
Product Description
Tflex SF10 Non-Silicone Thermal Gap Filler is a ceramic-filled thermoplastic sheet material for thermal interfaces in silicone-sensitive electronic assemblies. The 10 W/(m K) material combines low-pressure deflection with surface wetting that reduces contact resistance across component-to-hardware gaps. Available in 0.3 to 5.0 mm thicknesses, the unreinforced construction can be supplied as standard sheets or converted die-cut parts, with optional tack configurations for placement control. Its electrical insulation and -40 to 125 deg C operating range support varied electronic gap-filling designs. Applications include thermal management in assemblies where silicone contamination or oil bleeding is a concern.
Key features
- 10 W/(m K) Non-Silicone Interface: Ceramic-filled thermoplastic provides high thermal conductivity without silicone.
- Low-Pressure Deflection: Soft deflection and surface wetting support low contact resistance.
- Unreinforced Convertible Sheet: The 0.3 to 5.0 mm material is available as sheets or custom die-cut parts.
Applications / Suitable for
- Silicone-sensitive electronic assemblies
- Component-to-housing thermal gap filling
- Converted thermal pads and die-cut parts
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Additional Information
As-supplied / before-processing properties
Typical supplied-material properties for the configurable Tflex SF10 sheet family.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Construction | Ceramic-filled non-silicone thermoplastic | No fiberglass reinforcement | |
| Color | Grey | Visual | |
| Thickness range | 0.3 to 5.0 | mm | Available in 0.25 mm increments |
| Density | 3.7 | g/cc | Helium pycnometer |
| Hardness, 3-second | 41 / 70 | Shore 00 | 1 to 4 mm / 0.3 to 0.75 mm; ASTM D2240 |
| Shelf life | 2 | years from shipment | Specified shelf life |
After-processing / final-state properties
Typical functional properties for Tflex SF10; installed results depend on thickness, pressure, temperature, and surface contact.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Bulk thermal conductivity | 10 | W/(m K) | Hot Disk |
| Thermal resistance | 0.71 | C-cm^2/W | 1.0 mm; 30% deflection; 50 deg C; ASTM D5470 |
| Operating temperature range | -40 to 125 | deg C | Laird test method |
| Dielectric constant | 9 | 1 MHz; ASTM D150 | |
| Volume resistivity | 1 x 10^14 | ohm cm | ASTM D257 |
| Outgassing TML / CVCM | 0.33 / 0.14 | % | ASTM E595 |
| Flammability | V-0 | UL 94 |
