LAIRD TFLEX HP34
Harmonization Code : 3824.99.92.97 | Prepared binders for foundry molds or cores; chemical products and preparations of the chemical or allied industries (including those consisting of mixtures of natural products), not elsewhere specified or included: other : other : other
Main features
- 34 W/m-K Bulk Conductivity
- Low Contact Resistance Under Pressure
- Non-Silicone Aligned-Graphite Construction
Product Description
Tflex HP34 High-Performance Thermal Gap Filler is a soft, aligned-graphite, non-silicone sheet material for demanding electronic thermal interfaces. Its 34 W/(m K) bulk thermal conductivity and low contact resistance support heat transfer across component-to-hardware gaps, while the compliant construction deflects under assembly pressure. The material is available in 1 to 5 mm thicknesses and is engineered to retain thermal performance as pressure increases, with best performance at 10 to 30 psi. Because the graphite structure has low volume resistivity, electrical isolation must be addressed in the assembly. Applications include servers, routers, wireless infrastructure, instrumentation, and portable electronics.
Key features
- Aligned-Graphite Thermal Path: Aligned graphite provides 34 W/(m K) bulk thermal conductivity.
- Low-Pressure Surface Contact: The compliant sheet supports low contact resistance, with best performance at 10 to 30 psi.
- Non-Silicone Sheet Construction: Available 1 to 5 mm thicknesses support converted thermal gap-filling parts.
Applications / Suitable for
- Servers and data infrastructure
- Routers and wireless infrastructure
- Instrumentation and test equipment
- Notebooks, tablets, and portable devices
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Additional Information
As-supplied / before-processing properties
Typical supplied-material properties for the Tflex HP34 sheet family.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Construction | Aligned graphite | Tflex HP34 material | |
| Color | Grey | Visual | |
| Thickness range | 1 to 5 | mm | Available sheet range |
| Density | 2.3 | g/cc | Helium pycnometer |
| Hardness | 50 | Shore 00 | ASTM D2240; 3-second reading |
| Shelf life | 2 | years from shipment | Specified shelf life |
After-processing / final-state properties
Typical installed-interface properties; thermal resistance depends on thickness, pressure, temperature, and surface contact.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Bulk thermal conductivity | 34 | W/(m K) | ASTM D5470 |
| Thermal resistance | 0.589 | C-cm^2/W | 1.5 mm; 30% deflection; 50 deg C; ASTM D5470 |
| Operating temperature range | -40 to 125 | deg C | Laird test method |
| Volume resistivity | 10 | ohm cm | ASTM D991 |
| Flammability | V-0 | UL 94 |
