LAIRD TFLEX HD93000
Harmonization Code : 3824.99.92.97 | Prepared binders for foundry molds or cores; chemical products and preparations of the chemical or allied industries (including those consisting of mixtures of natural products), not elsewhere specified or included: other : other : other
Main features
- 3.00 mm High-Deflection Pad
- 7.5 W/mK Thermal Conductivity
- Low-Outgassing Silicone Interface
Product Description
Tflex HD93000 High-Deflection Thermal Gap Filler is a 3.00 mm grey ceramic-filled silicone pad for filling larger component-to-hardware thermal gaps under controlled compression. The HD90000 material combines 7.5 W/(m K) thermal conductivity with Shore 00 hardness of 32, low outgassing, and electrical insulation. Its preformed format supports direct placement without mixing or cure while conforming across irregular component and housing surfaces. Its one-year shelf life supports controlled inventory planning for converted pad programs. Applications include automotive electronics, industrial controls, portable devices, routers, instrumentation, gaming systems, and wireless infrastructure.
Key features
- 3.00 mm Preformed Pad: The HD93000 configuration provides a 0.120 inch interface for larger assembly gaps.
- 7.5 W/(m K) Thermal Conductivity: Ceramic-filled silicone supports heat transfer through the compressed pad layer.
- Low-Outgassing Insulating Material: The silicone sheet combines controlled emissions with high volume resistivity.
Applications / Suitable for
- Automotive and industrial electronic modules
- Portable devices, routers, and gaming systems
- Instrumentation and wireless infrastructure
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Additional Information
As-supplied / before-processing properties
Typical as-supplied HD90000 material properties for the 3.00 mm Tflex HD93000 configuration.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Construction | Ceramic-filled silicone sheet | Tflex HD90000 series | |
| Color | Grey | Visual | |
| Nominal thickness | 3.00 | mm | 0.120 inch product configuration |
| Density | 3.50 | g/cc | Helium pycnometer |
| Hardness | 32 | Shore 00 | ASTM D2240; 1000 um and above |
| Outgassing TML | 0.170 | % | ASTM E595 |
| Outgassing CVCM | 0.010 | % | ASTM E595 |
| Shelf life | 1 | year from shipment | Typical series property |
After-processing / final-state properties
Typical HD90000 thermal, temperature, electrical, and flammability properties applicable to the 3.00 mm HD93000 configuration.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Thermal conductivity | 7.5 | W/(m K) | Hot Disk |
| Operating temperature | -65 to 125 | deg C | Current product page |
| Dielectric constant | 8.10 | At 1 MHz | |
| Volume resistivity | 8.70 x 10^13 | ohm cm | ASTM D257 |
| Flammability | UL 94 V-0 | Typical series property |
