LAIRD TFLEX HD92000
Harmonization Code : 3824.99.92.97 | Prepared binders for foundry molds or cores; chemical products and preparations of the chemical or allied industries (including those consisting of mixtures of natural products), not elsewhere specified or included: other : other : other
Main features
- 2.00 mm High-Deflection Interface
- 7.5 W/mK Heat Transfer
- 82% Deflection at 50 psi
Product Description
Tflex HD92000 High-Deflection Thermal Gap Filler is a 2.00 mm grey ceramic-filled silicone pad for compliant thermal contact across wider electronic assembly gaps. The HD90000 material provides 7.5 W/(m K) thermal conductivity with Shore 00 hardness of 32 and strong pressure-responsive deflection. At 10 psi, the 2.00 mm configuration has typical thermal resistance of 0.35 deg C-in2/W and 27% deflection; deflection reaches 82% at 50 psi. Applications include automotive electronics, portable devices, routers, instrumentation, gaming systems, and wireless infrastructure.
Key features
- 2.00 mm High-Deflection Interface: The HD92000 configuration provides a 0.080 inch compliant thermal pad.
- 7.5 W/(m K) Thermal Conductivity: Ceramic-filled silicone supports heat transfer across controlled component gaps.
- Pressure-Responsive Conformability: Typical deflection increases from 27% at 10 psi to 82% at 50 psi.
Applications / Suitable for
- Automotive and industrial electronic modules
- Portable devices, routers, and gaming systems
- Instrumentation and wireless infrastructure
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Additional Information
As-supplied / before-processing properties
Typical as-supplied HD90000 material properties for the 2.00 mm Tflex HD92000 configuration.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Construction | Ceramic-filled silicone sheet | Tflex HD90000 series | |
| Color | Grey | Visual | |
| Nominal thickness | 2.00 | mm | 0.080 inch product configuration |
| Density | 3.50 | g/cc | Helium pycnometer |
| Hardness | 32 | Shore 00 | ASTM D2240; 1000 um and above |
| Outgassing TML | 0.170 | % | ASTM E595 |
| Outgassing CVCM | 0.010 | % | ASTM E595 |
| Shelf life | 1 | year from shipment | Typical series property |
After-processing / final-state properties
Typical HD92000 thermal and deflection data at the stated pressures; installed results depend on surface contact and assembly compression.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Thermal conductivity | 7.5 | W/(m K) | Hot Disk |
| Thermal resistance at 10 psi | 0.35 | deg C-in2/W | Typical 2.00 mm configuration |
| Thermal resistance at 30 psi | 0.09 | deg C-in2/W | Typical 2.00 mm configuration |
| Thermal resistance at 50 psi | 0.09 | deg C-in2/W | Typical 2.00 mm configuration |
| Deflection at 10 psi | 27 | % | Typical 2.00 mm configuration |
| Deflection at 50 psi | 82 | % | Typical 2.00 mm configuration |
| Operating temperature | -65 to 125 | deg C | Current product page |
| Dielectric constant | 8.10 | At 1 MHz |
