LAIRD TFLEX 3130
Harmonization Code : 8473.30.80.00 | Parts and accessories (other than covers, carrying cases and the like) suitable for use solely or principally with machines of headings 8470 to 8472 ; Parts and accessories of the machines of heading 8471 ; Other; Other
Main features
- 3.25 mm Tflex 300 Gap Filler
- Greater Than 50% Deflection at 50 psi
- 1.2 W/(m K) Thermal Conductivity
Product Description
Tflex™ 3130 is a 3.25 mm-thick configuration of the Tflex™ 300 Series, a ceramic-filled silicone thermal gap filler designed to conform around components and bridge gaps between heat-generating devices and adjacent cooling surfaces. The light-green thermal interface material provides typical thermal conductivity of 1.2 W/m·K and deflects by more than 50% of its original thickness at 50 psi. Its highly compliant construction and low compression set make it suitable for filling larger interface gaps while maintaining effective thermal contact between electronic components and cooling hardware.
Key features
- Highly compliant construction: Deflects by more than 50% of its original thickness at 50 psi, supporting conformity around component topography.
- Thermal gap-filling performance: Provides typical thermal conductivity of 1.2 W/m·K when tested according to ASTM D5470.
- Broad thickness availability: Offered from 0.50 mm (0.020 in) to 5.08 mm (0.200 in), with standard and custom-converted formats available.
Applications / Suitable for
- Automotive electronics, infotainment, ADAS, and powertrain or ECU assemblies
- Routers and wireless infrastructure
- Notebooks, tablets, portable devices, gaming systems, and smart-home devices
- Instrumentation and drone or satellite electronics
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Additional Information
As-supplied / before-processing properties
Typical uninstalled properties and available dimensions for the Tflex 300 Series. Values are for design guidance and are not guaranteed specifications. :contentReference[oaicite:1]{index=1}
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Construction and composition | Ceramic-filled silicone sheet | — | Product construction |
| Color | Light green | — | Visual |
| Thickness range | 3.25 | mm | Nominal uncompressed thickness range |
| Density | 1.78 | g/cc | Helium pycnometer |
| Hardness | 51.4 for 20–30 mil 25.2 for 40 mil and above |
Shore 00 | ASTM D2240; thickness-dependent result |
| Shelf life | 2 | years | From date of shipment; storage conditions not stated on the product page |
After-processing / final-state properties
Typical thermal, electrical, environmental, and installed-interface properties of Tflex 300. Values are not intended as guaranteed design limits. :contentReference[oaicite:2]{index=2}
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Thermal conductivity | 1.2 | W/m·K | ASTM D5470 |
| Thermal resistance | 0.98 | °C·in²/W | Modified ASTM D5470; 40 mil thickness, 10 psi, 50°C |
| Deflection | >50 | % | At 50 psi; thickness-specific curves are provided in the datasheet |
| Operating-temperature range | -40 to 160 | °C | Documented product temperature range |
| Dielectric constant | 4.5 | — | ASTM D150 at 10 GHz |
| Volume resistivity | 1013 | ohm·cm | ASTM D257 |
| Outgassing | TML: 0.56 CVCM: 0.10 |
wt% | ASTM E595 |
| Flammability rating | V-0 | — | UL 94 |
