KESTER TSF-8808
Harmonization Code : 3810.90.90 | Fluxes and other auxiliary preparations for soldering, brazing, welding
Main features
- DI-Water-Cleanable Post-Reflow Residues
- Multi-Alloy Air-or-Nitrogen Reflow
- ORH0 Low-Volatility Soldering Flux
Product Description
KESTER TSF-8808 is a synthetic, water-soluble tacky soldering flux for electronics assembly and rework. The low-volatility formulation is designed to reduce outgassing during reflow and has no intentionally added halogens; it is formulated to meet the IEC 61249-2-21 definition for halide-free materials and carries ANSI/J-STD-004B flux designator ORH0. TSF-8808 supports low-melting SnBi, tin-lead eutectic, and higher-melting SnAg, SnCu, and SnAgCu metallurgies, with reflow in air or nitrogen. After reflow, residues are completely water-soluble and can be removed with DI water without cleaning additives. The flux is documented for printing, pin transfer, dispensing, rework, flip-chip, chip-scale-package, and flip-chip bumping applications.
Key features
- DI-water-cleanable residues: Post-reflow residues are completely water-soluble and can be removed with de-ionized water without cleaning additives.
- Low-volatility formulation: Designed to reduce outgassing during reflow and associated component movement or misalignment, particularly for thin flip-chip die.
- Broad soldering compatibility: Supports SnBi, tin-lead eutectic, SnAg, SnCu, and SnAgCu metallurgies and can reflow in air or nitrogen.
Applications / Suitable for
- Stencil and screen printing
- Pin transfer, dot dispensing, and syringe application
- PCB rework applications
- Flip-chip and chip-scale-package assemblies
- Flip-chip bumping sites
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Additional Information
As-supplied / before-processing properties
Typical physical, chemical, and handling properties for product evaluation. Typical values are reference data and are not guaranteed specifications.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Visual appearance | Pale white | — | Kester Method #1W-QC-G-18 |
| Viscosity | 230 | poise | Typical; J-STD-004B, IPC-TM-650, Method 2.4.34.4 |
| Acid number | 52 | — | Typical; J-STD-004B, IPC-TM-650, Method 2.3.13 |
| Tackiness | 70 | grams-force | Typical; Kester Method #1W-QC-3-04 |
| Quantitative halogen | None | — | BS EN14582, Halogen Analysis O2 Bomb |
| Quantitative halides | None | — | J-STD-004B, IPC-TM-650, Method 2.3.42 |
| Storage temperature | 0 to 10 (32 to 50) | °C (°F) | Standard refrigerated storage conditions |
| Shelf life | 10 | months | From date of manufacture when refrigerated and handled properly |
After-processing / final-state properties
Reported corrosion and electrical reliability results from standardized flux testing. Results apply to the stated test methods and should not be interpreted as universal assembly-level reliability performance.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Copper mirror corrosion | Low | — | J-STD-004, IPC-TM-650, Method 2.3.32 |
| Corrosion test | Low | — | J-STD-004, IPC-TM-650, Method 2.6.15 |
| Electrochemical migration (ECM) | Pass; 6.34 × 1011 at 96 h; 1.01 × 1011 at 500 h | Ω | Typical; J-STD-004B, IPC-TM-650, Method 2.6.14.1 |
| Surface insulation resistance (SIR) | Pass; 6.04 × 109 Day 1; 8.49 × 109 Day 4; 9.50 × 109 Day 7 | Ω | Typical TSF-8808 values; J-STD-004B, IPC-TM-650, Method 2.6.3.7 |
