KESTER EM828 Solder Paste
Harmonization Code : 3810.10.00 | Soldering, brazing or welding powders and pastes consisting of metal and other materials
Main features
- Low-voiding
- Excellent wetting
- Long stencil life
Product Description
Kester EM828 is a lead-free, water-soluble solder paste formulated specifically to reduce voiding behavior that is common with lead-free solder paste products. It is breakthrough in water-soluble solder paste technology with the combination of low voiding, excellent wetting behavior and ease of cleaning. Additionally, EM828 is extremely stable in the stencil printing process, regardless of print speed, idle time and throughput. KESTER EM828 provides tremendous wetting to a wide variety of board and component finishes in order to simplify your transition to lead-free processes.
Product Key Features
- Low-voiding underneath area array components
- Excellent wetting on a variety of metalizations
- Long stencil life and tack time
- Print speed up to 150mm/second (6 inch/second)
Applications
- Stencil and enclosed head printing (89.5% metal)
Note: Due to changes in REACH Regulations, this product is no longer sold into Europe or to European customers.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Additional Information
Reflow Profile
The recommended reflow profile for EM828 made with SAC alloys is shown here. This profile is simply a guideline. Since EM828 is a highly active solder paste, it can solder effectively over a wide range of profiles. Your optimal profile may be different from the one shown based on your oven, board, and mix of defects. Please contact Technical Support if you need profiling advice.
Preheat Zone:
- Duration: 45–90 seconds
- Temperature ramp up from ~25°C to ~150°C
- Average Ramp Rate: 1–2°C/sec
Soak Zone:
- Duration: 60–120 seconds
- Temperature range: ~150°C to ~200°C
Reflow Zone:
- Duration: 45–90 seconds
- Peak Temperature: 235–250°C
Total Profile Length: 3–5 minutes.
