JNC PI-6643-004 | Insulating Polyimide Ink
Harmonization Code : 32159090 | Printing ink, writing or drawing ink, and other inks, whether or not concentrated or solid, specifically for those classified as other within that category
Main features
- Thermal Curable
- High Heat Resistance
- Inkjet Printing
Product Description
PI-6643-004 is a high-heat insulating polyimide ink specially designed to meet the demands of high thermal applications, which provide solutions for heat resistance and insulation applications.
PI-6643-004 is engineered to be a thermally curable polyimide ink with remarkable insulating properties making it an ideal choice for electrical isolation and heat management applications. Its polyimide-based chemistry brings forth the balance between flexibility and resilience. With a high Tg of 395°C, this enabled high resistance features that can withstand extreme heat conditions. Moreover, this ink has a mere 2% water absorbance, making it impervious to moisture-induced vulnerabilities. Its reliability remains intact even in environments with varying humidity levels.
This ink can also be utilised as a Removable, structural material, as long as it is cured at a temperature of ±100°C. If you fully cure it, to get its insulating ink properties, then it is not solubable, etchable or generally removable anymore.
Industry Applications:
Aerospace Engineering | Electronics Manufacturing | High Temperature Sensors | Industrial Furnace Components
Cure condition
- 350⁰C in 30 min
JNC PI-6643-004
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Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Mechanical Properties
Chemical Properties
Physical Properties
Additional Information
| Properties | PI-6643-004 |
| Solids content (wt. %) | 25 |
| Viscosity (mPa's) @25℃ | 12 |
| Surface tension (mN/m) @23℃ | 30 |
| Printing methods | Inkjet |
| Curing | 350℃ 30min |
| Post-curing | - |
| Volume resistivity (Ω*cm) | 1E+16 |
| Breakdown voltage (V/um) | 150 |
| Dielectric constant (1kHz) @1V | 3.2 |
| Tensile modulus (MPa) | 1530 |
| Elongation (%) | 3 |
| Residual stress (MPa) | 57 |
| 5% weight loss temp (℃) | 435 |
| CTE ( | 60 |
| Tg (℃) | 395 |
| Water absorbance (%) @23℃ | 2.0 |
PI-6643 has been used in Power-IC with Cu wiring.
Printing with SiN, Cu, and Au is affected by the roughness of each metal surface, but beyond that, it is also greatly affected by the ink volume of the inkjet head, the printing resolution, and the heating of the substrate - something that the inkjet equipment manufacturer can confirm.
