JNC PI-6302-004 | Insulating Polyimide Ink

PI-6302-004 is a low-temperature cured insulating polyimide ink specially designed to meet the demands of high thermal applications, which provide solution for heat resistance and insulation applications.

PI-6673-004 is engineered to be a thermally curable polyimide ink with remarkable insulating properties making it ideal choice for electrical isolation and heat management applications. Its polyimide-based chemistry brings forth the balance between flexibility and resilience. PI-6673-004 features a residual stress of 32 MPa and a coefficient of thermal expansion (CTE) of 65 ppm/K, ensuring compatibility with various materials and minimizing the risk of performance-altering mismatches. Moreover, with a breakdown voltage of 100 V/um and a dielectric constant of 2.8 @ 1 kHz, ensuring stable electrical isolation and signal integrity for your components.

Industry Applications:

Electronics Manufacturing | Consumer Electronics | Sensors and IoT Devices

Cure condition

• 230⁰C in 30 min