INDIUM 804120
Harmonization Code : 3208.20.90 | Paints and varnishes that are dispersed or dissolved in a non aqueous medium
Main features
- Wide Printing Process Window
- Low-Voiding Water-Soluble Flux
- SAC305 Type 4 Configuration
Product Description
Indium 804120 Water-Soluble Solder Paste is a SAC305 Type 4 solder paste supplied in a 500 g jar for lead-free SMT printing and reflow. The listed 6.5R flux system combines a water-soluble residue with a broad printing and reflow process window, long stencil life, and sustained tack. Its SAC305 alloy has a 217 to 220 deg C melting range, while the recommended working environment is 23 to 28 deg C. Heated deionized water is used for residue removal after reflow. Applications include stencil printing and air or nitrogen reflow for assemblies that require a water-cleanable flux system.
Key features
- SAC305 Type 4 Configuration: The exact part is listed with SAC305 alloy, Type 4 powder, and a 500 g jar.
- Wide Printing Window: The 6.5R flux system supports long stencil life, response-to-pause, and varied print speeds.
- Water-Cleanable Residue: Post-reflow residue is removed with heated deionized water.
Applications / Suitable for
- SAC305 SMT stencil printing
- Air or nitrogen reflow
- Water-cleaned circuit board assembly
TDS, SDS & Technical Documents
Technical Specifications
Other Properties
Additional Information
As-supplied / before-processing properties
Exact-part distributor specifications supplemented by the directly linked Indium6.5R series data for the same listed flux system.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Alloy | SAC305 | Exact part listing | |
| Powder size | Type 4 | Exact part listing | |
| Package size | 500 | g | Jar |
| Melting range | 217 to 220 | deg C | SAC305 exact part listing |
| Working environment | 23 to 28 | deg C | Listed operating temperature |
| Typical viscosity | 2,000 | poise | Indium6.5R series; Type 4 powder |
| Shelf life | 182 | days | Exact part listing |
