Hysol MG33F-0659 | Black Epoxy Mold Compound

Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other

MG33F-0659 Black Epoxy Mold Compound for Tantalum CapacitorsHysol MG33F-0659 | Black Epoxy Mold CompoundMG33F-0659 Black Epoxy Mold CompoundHysol MG33F-0659 Black Epoxy Mold Compound for Tantalum Capacitors

Main features

  • Automold Tantalum capacitors
  • Low moisture absorption
  • High moldability and fast cycle time

Product Description

Hysol MG33F-0659 is a black, semiconductor-grade epoxy molding compound (duroplast) designed for the encapsulation and protection of tantalum capacitors and surface mount resistors. Because of its fast cure, it is also very well suited for the manufacture of reed relays. 

Hysol MG33F-0659 has a filler weight of 75% and is formulated with a short gel time to make it useful for the production of (Ta) Tantalum capacitors through automolding processes. It is an environmentally friendly "green" molding compound which contains no bromine, antimony or phosphorus flame retardant and meets UL 94 V-0 Flammability at 6.35mm thickness.

Typical applications:

Features:

  • Fast cured formulation (Check the curing conditions)
  • Long spiral flow to provide best moldability and wide molding latitude
  • Great adhesion to copper substrates and CTE matched with Al
  • High thermal stability (High Tg and low stress )
  • Low mold shrinkage (0.16%) for large components molding

 

Product Family

HYSOL MG33F-0659

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TDS, SDS & Technical Documents

Technical Specifications

General Properties
ColorColor
Black
Filler ContentFiller Content
76 %
Specific GravitySpecific Gravity
1.83
Electrical Properties
Volume ResistivityVolume Resistivity
3000000000000000 Ohms⋅cm
Thermal Properties
Glass Transition Temperature (Tg)Glass Transition Temperature (Tg)
175 °C
UL 94 RatingUL 94 Rating
V0
Chemical Properties
Moisture absorptionMoisture absorption
0.45 %
Curing Conditions
Transfer PressureTransfer Pressure
40 - 85 kg/cm2
Transfer TimeTransfer Time
6 - 15 s
Physical Properties
Spiral Flow @ 175°CSpiral Flow @ 175°C
66.04 cm

Additional Information

MG33F-0659 Epoxy Mold Compound for Aluminum Housed Resistors

Hysol MG33F-0659 is formulated based on MG33-0690, which is a industrial proven product for aluminum housed resistors encapsulation. They have pretty similar properties. You could check the properties comparison table below. Two extra advantages of MG33F-0659 are:

  • (1) MG33F-0659 contains green flame retardants and meet UL90 V-0 flammability @1/4 inches, which MG33-0690 does not have.
  • (2) MG33F-0659 has lower mold shrinkage than MG33-0690.

In conclusion, Hysol MG33F-0659 is a good alternative to MG33-0690 for aluminum housed resistor application. 

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