Hysol KL-G200S | Black Epoxy Mold Compound
Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
- MSL 1 260°C
- Low Cost of Ownership for Halogen free
- Designed for DO214 (SMA, SMB & SMX) packages
Product Description
Hysol KL-G200S is a black, halogen-free, semiconductor grade epoxy molding compound. It provides the lowest cost of ownership for a "non-halogen containing" epoxy molding compound. It works on surface mounted diodes such as D0214 in various sizes (SMA, SMB, SMC) and other low end discrete semiconductor and sensor packages.
Hysol KL-G200S passes MSL1 260°C. It is an epoxy molding compound that contains no bromine, antimony or phosphorus flame retardant. This product is designed to achieve JEDEC Level 1 requirements, at 260°C reflow temperature and provides the lowest cost of ownership with superior moldability and reliability. To top this up, it meets UL 94 V-0 Flammability at 6.35mm thickness.
HYSOL KL-G200S
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
Shipping in 12 weeks
Shipping in 12 weeks
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