Hysol KL-G100S | Black Epoxy Mold Compound
Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
- Low CTE (13 ppm/°C)
- Low stress
- For SOD, MBF, ABS packages
Product Description
Hysol KL-G100S is a black, semiconductor grade, high productivity molding compound, providing a wide operation window. It is 80% filled with spherical/fused silica and achieves a flammability rating of V0 at UL94 testing conditions.
Hysol KL-G100S is an environmentally friendly molding compound with high moldability that has a low coefficient of thermal expansion (13ppm/°C). It is typically used for SOD, MBF and ABS semiconductor packages. Its CTI, comparative tracking index value is 525V.
HYSOL KL-G100S
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Technical Specifications
General Properties
Chemical Properties
Physical Properties
Thermal Properties
Mechanical Properties
Curing Conditions
Additional Information
Additional Technical Information
| Property | Unit | Temperature | ||
| 25℃ | 150℃ | 175℃ | ||
| Chlorine (Cl⁻) | ppm | 15 | ||
| Sodium (Na⁺) | ppm | 4 | ||
| Potassium (K⁺) | ppm | 1 | ||
| Bromine (Br⁻) | ppm | 0 | ||
| Sulfate (SO₄²⁻) | ppm | 1 | ||
| Electrical Conductivity (oEW) |
uS/cm | 20 | - | - |
| Flexural Strength | MPa | 145 | 91 | 61 |
| Flexural Modulus | MPa | 12,577 | 612 | 501 |
| Adhesion Strength to Cu (Post-PMC) |
MPa | 0.90 | 1.14 | 1.02 |
| Adhesion Strength to Cu (Post-MSL3) |
MPa | 0.40 | 0.17 | 0.12 |
