Hysol GR9810-1P | Black Epoxy Mold Compound
Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other



Main features
- For sensors & modules
- Advanced warpage control
- Reliability and wire sweep control
Product Description
Hysol GR9810-1P is a heat curable, state of the art, black, semiconductor epoxy molding compound developed to meet the stringent encapsulation requirements of package on package (POP and SCSP). It has been formulated to provide the best possible moldability and as wide a molding latitude as possible. It is a Green, halogen free product with, excellent dimensional stability, low shrinkage and High Tg.
Hysol GR9810-1P and its related product GR9810-1PF offer a new technology platform on which Hysol develops epoxy mold compounds for high reliability sensors and modules such as humidity and temperature sensors. Key features of GR9810-1P are summarized as below.
Reliability
- Improved adhesion promoter and toughening system
- High filler loading (>85%) for lower moisture uptake
- Reduced moisture uptake for best MSL performance
Warpage Control
- Multifunctional resin hardener system with high Tg
- High cross-linking degree with special toughening system
- High filler loading for low CTE to minimize thermal mismatch
- High performance stress modifier to reduce internal stress
Wire Sweep Control
- Optimized filler PSD with 75um (-1P) or 45um (-1PF) filler cut
- Low viscosity resin and latent catalyst for ultra long flow
Hysol GR9810-1P is developed for advanced reliability control. The goal of this technology platform is to introduce an epoxy mold compound capable of passing MSL1 260°C on some devices and at least MSL3 260°C on a stacked CSP (PoP) devices. Check reliability test results and typical application Humidity Sensor.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Chemical Properties
Physical Properties
Curing Conditions
Additional Information
GR9810-1P Internal Test Results
1. GR9810-1P has passed MSL3 3 x 260°C reliability test on large device.

2. GR9810-1P has high Tg and high temperature stability.

3. GR9810-1P has low viscosity and long flow for wide process window.

GR9810-1P Customer's Application
Sensor devices (such as our Smartlinq USB Temperature Data Loggers or our other Temperature Data Loggers) require precise, reliable and cost-effective humidity measurement and control. This allows them to be used reliability and effectively in a wide variety of applications such as consumer goods, automotive, logistics and HVAC applications. As such, GR9810-1P:
- Is used in variety of applications including mobile devices
- Passes 160ºC high temperature operating tests
- Passes MSL1& 1000 TC customer reliability
- Has the best adhesion on PPF lead frames
- Is compatible with Cavity and Film Assisted Molding process
Digital humidity and temperature sensors























