Hysol GR825-73B | Black Epoxy Mold Compound
Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
- MSL 1 260°C
- Designed for SOIC, SOP, SSOP & QSOP
- Ideal for NiPdAu (PPF) & Ag-spot leadframes
Product Description
Hysol GR825-73B is approaching EOL and may be discontinued by 2023. The recommended alternative for SOIC packages is Hysol GR710F
Hysol GR825-73B is a black, semiconductor grade epoxy molding compound that was designed for SOIC packages. It was first qualified as MSL1 260°C on a 14 pin SOIC package with a die size of 1.4x 0.9mm (58 x 36 mils) using a Nickel Palladium Gold (NiPdAu) leadframe, also referred to as a preplated leadframe (PPF). It has since been used in mass production on this semiconductor package. Except for SOIC, it can also be used on, SOP, SSOP & QSOP packages.
Hysol GR825-73B is an environmentally friendly "green" molding compound which contains no bromine, antimony or phosphorus flame retardant and has been used in mass scale production since 2007. GR825-73B epoxy mold compound meets UL 94 V-0 Flammability at 3mm (1/8") thickness.
HYSOL GR825-73B
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
Shipping in 12 weeks
Shipping in 12 weeks
Shipping in 12 weeks
