Hysol GR750 | Black Epoxy Mold Compound
Harmonization Code : 3907.30.00.40 | Epoxy Mold Compounds containing by weight more than 70 % silicon dioxide
Main features
- For SiC, GaN semiconductors
- Very High Tg: 235°C
- Excellent adhesion to Nickel (Ni) leadframes
Product Description
Hysol GR750 is a halogen free, black, silica filled (75um cut size) semiconductor grade epoxy molding compound. It offers an high Tg (225°C) along with low moisture absorption, low viscosity and excellent adhesion to Nickel (Ni) leadframes, only to be beaten by GR750 X1 (194N tab pull). The GR750 product series has been developed with 3rd generation semiconductors in mind and is the product of choice for Silicon Carbide (SiC) and Gallium Nitride (GaN) packages.
Hysol GR750 is a technologically advanced green epoxy molding compound with excellent electrical performance, designed for high power devices especially for high temperature application with low moisture absorption requirements. It delivers outstanding performance and ease of use. It meets UL 94 V-0 flammability at 1/8 inch thickness.
Available Versions:
HYSOL GR750
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
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General Properties
Electrical Properties
Chemical Properties
Physical Properties
Thermal Properties
Additional Information
GR750 EMC for High Power & Voltage SiC Devices
Product Comparison Table
|
Product Name |
MG15F-MOD2 |
MG15F-0140 |
GR750 (Std) |
GR750 X1 (Std) |
GR750X1 |
GR720X2 (Std) |
GR750 X2FF |
GR720X2 (high CTE) |
||
|---|---|---|---|---|---|---|---|---|---|---|
|
Epoxy type |
- |
OCN/BisA/DCPD |
OCN/BisA |
MFN |
MFN/L.W.A. |
MFN/L.W.A. |
MFN/L.W.A. |
MAR |
MAR/L.Vis. |
|
|
Hardener type |
- |
Anhydride |
Anhydride |
New |
New |
New |
New |
New |
New |
|
|
Filler cut size |
µm |
106 |
150 |
75 |
75 |
75 |
75 |
45 |
75 |
|
|
Flammability |
UL-94 |
V-0 at ¼” |
V-0 at 1/8'' |
V-0 at 1/8'' |
V-0 at 1/8'' |
V-0 at 1/8'' |
V-0 at 1/8'' |
V-0 at 1/8'' |
V-0 at 1/8'' |
|
|
Spiral Flow |
inches |
36 |
20 |
42 |
36 |
26 |
45 |
40 |
41 |
|
|
Gel Time |
sec |
32 |
17 |
26 |
24 |
29 |
30 |
30 |
35 |
|
|
Viscosity @ 175°C |
PaS |
20 |
28 |
10 |
13 |
43 |
25 |
20 |
15 |
|
|
Tg by TMA |
oC |
242 |
195 |
225 |
202 |
197 |
170 |
182 |
170 |
|
|
CTE 1 |
ppm/°C |
16 |
21 |
10 |
8 |
6 |
9 |
9 |
14 |
|
|
CTE 2 |
ppm/°C |
49 |
70 |
40 |
42 |
31 |
35 |
32 |
40 |
|
|
DMA Storage Modulus at RT |
MPa |
18246 |
14078 |
20560 |
23155 |
29241 |
21631 |
23391 |
20971 |
|
|
DMA Storage Modulus at 260C |
MPa |
6491 |
1883 |
1658 |
1713 |
1711 |
907 |
1007 |
961 |
|
|
Tg by DMA Tanδ Peak |
0C |
270 |
217 |
235 |
207 |
200 |
177 |
182 |
177 |
|
|
Flexural modulus |
Mpa |
16312 |
12449 |
16880 |
18042 |
21469 |
17470 |
17549 |
16900 |
|
|
Flexural strength |
Mpa |
120 |
126 |
138 |
136 |
134 |
152 |
169 |
150 |
|
|
Moisture absorption PCT24h |
% |
0.55 |
0.65 |
0.35 |
0.3 |
0.2 |
0.2 |
0.2 |
0.2 |
|
|
Cl-/ Na+ |
ppm |
<10 |
<10 |
<15 |
<15 |
<15 |
<15 |
<15 |
<15 |
|
|
PH |
|
4~6 |
4~6 |
5~7 |
5~7 |
5~7 |
5~7 |
5~7 |
5~7 |
|
|
Volume resistivity @21C & 500V |
Ω.cm |
2.4E+16 |
6.3E+16 |
3.3E+16 |
1.7E+16 |
1.0E+16 |
1.6E+16 |
1.8E+16 |
1.0E+16 |
|
|
Dielectric constant, 21 C & 1MHz |
|
3.6 |
3.7 |
3.7 |
3.7 |
3.7 |
3.8 |
3.8 |
3.9 |
|
|
Adhesion (tabpull) after MSL3 |
on Cu |
N |
344 |
136 |
365 |
406 |
307 |
360 |
407 |
331 |
|
on Ag |
N |
235 |
NA |
345 |
363 |
269 |
234 |
348 |
415 |
|
|
on Ni |
N |
84 |
111 |
170 |
194 |
130 |
104 |
102 |
110 |
|
|
Comparative Tracking Index |
V |
600 |
400 |
600 |
600 |
600 |
600 |
600 |
600 |
|
|
Recommended Molding condition |
190°C110s |
180°C100s |
180°C 90s |
180°C 90s |
180°C 90s |
180°C 90s |
180°C 90s |
180°C 90s |
||
|
Recommended PMC condition |
190°C 3~6hrs |
190°C 3~6hrs |
190°C10hrs |
190°C10hrs |
190°C10hrs |
190°C10hrs |
190°C10hrs |
190°C10hrs |
||
DETA Data for the GR7XX product line
DMA and TMA curves of GR750 (Standard)
