Hysol GR700 C3D | Black Epoxy Mold Compound
Harmonization Code : 3907.30.00.40 | Epoxy Mold Compounds containing by weight more than 70 % silicon dioxide
Main features
- Low stress
- For high power devices
- Good electrical performance
Product Description
Hysol GR700 C3D, also known as GR700-FM, is a halogen free, black, silica filled (87% filler weight) semiconductor grade epoxy molding compound. This low stress, high adhesion compound has very good electrical performance and is a proven, commercially available product code. This is a product that has achieved MSL 1 and its comparative tracking index (CTI) is 575V.
Hysol GR700 C3D is a technologically advanced, halogen free, green epoxy molding compound with excellent electrical performance, designed for high power devices applications with low moisture absorption requirements. Typical use can be in TO, SOIC, TSOP, QFP and PQFN semiconductor packages. Furthermore, it meets UL 94 V-0 flammability at 1/8 inch thickness.
HYSOL GR700 C3D
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
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Shipping in 12 weeksTDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Chemical Properties
Physical Properties
Curing Conditions
Additional Information
GR700 is a product Series that can replace GR828-FC1 for power SOTs. FC initials might remind you of Fairchild. Fairchild has been acquired by Onsemi in 2017 so their products still live on.
