Hysol GR2710FF | Gold Epoxy Mold Compound

Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other

GR2710FF Gold Fine Filler Epoxy Mold CompoundHysol GR2710FF | Gold Epoxy Mold Compound

Main features

  • For conductive polymer and AO capacitors
  • Excellent thin wall crack resistance
  • Fine-filler version of GR2710

Product Description

Hysol GR2710FF is a gold (yellow) fine-filler semiconductor-grade epoxy molding compound designed for the encapsulation and protection of Conductive Polymer type, Tantalum capacitors. Once molded and post-mold cured, this product provides optimum protection and reliability for these capacitor devices. It is a fine-filler version of GR2710.

Hysol GR2710FF is designed for Polymer Conductive and Aluminum Organic Capacitors. These devices offer very high capacitance in a very small size. Epoxy molding compounds designed for these capacitors must have very low stress and very good thin wall crack resistance as they should be able to pass the MSL performance on these package types. That's why GR2710FF exhibits both low stress and excellent thin wall crack resistance.

Hysol GR2710FF is an environmentally "green" product, meaning that it doesn't contain any halogens including bromine, antimony or phosphorus flame retardants and replaces, halogen containing, older generation products. This material is designed to achieve JEDEC Level 1 requirements at 260°C reflow temperature on Aluminum Organic (AO) capacitors as well as conductive polymer capacitors. Its fast cure time also ensures that it is compatible with the latest automold manufacturing equipment. Hysol GR2710FF meets UL 94 V-0 Flammability at 1/4 inch (6.35mm) thickness.

Product Family

HYSOL GR2710FF

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TDS, SDS & Technical Documents

Technical Specifications

General Properties
ColorColor
Gold
Filler ContentFiller Content
84 %
Specific GravitySpecific Gravity
1.96
Thermal Properties
Glass Transition Temperature (Tg)Glass Transition Temperature (Tg)
160 °C
Thermal ConductivityThermal Conductivity
0.8 W/m.K
UL 94 RatingUL 94 Rating
V0
Electrical Properties
Volume ResistivityVolume Resistivity
11000000000000000 Ohms⋅cm
Chemical Properties
Moisture absorptionMoisture absorption
0.47 %
Physical Properties
Spiral Flow @ 175°CSpiral Flow @ 175°C
116 cm
Mechanical Properties
Molded ShrinkageMolded Shrinkage
0.12 %
Curing Conditions
Transfer PressureTransfer Pressure
40 - 85 kg/cm2
Transfer TimeTransfer Time
6 - 15 s

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