Hysol GR2710 | Gold Epoxy Mold Compound

Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other

GR2710 Gold Epoxy Mold CompoundHysol GR2710 | Gold Epoxy Mold Compound

Main features

  • For conductive polymer and AO capacitors
  • Excellent thin wall crack resistance
  • Fast cure for automold equipment

Product Description

Hysol GR2710 is a gold semiconductor-grade epoxy molding compound designed for the encapsulation and protection of Conductive Polymer Capacitors and Aluminum Organic (AO) capacitors. Once molded and post-mold cured, this product provides optimum protection and reliability for these capacitor devices.

Hysol GR2710 is designed for Polymer Conductive and Aluminum Organic Capacitors. These devices offer very high capacitance in a very small size. Epoxy molding compounds designed for these packages must have very low stress and very good thin wall crack resistance so that they can achieve the appropriate MSL performance, something that GR2710 promptly exhibits.

Hysol GR2710 is a High Tg, environmentally "green" product, meaning that it doesn't contain any halogens including bromine, antimony or phosphorus flame retardants. This next generation epoxy mold compound replaces these older generation products. It is designed to achieve JEDEC Level 1 requirements at 260°C reflow temperature on Aluminum Organic (AO) capacitors as well as conductive polymer capacitors. Its fast cure time also ensures that it is compatible with the latest automold manufacturing equipment. 

Product Family

HYSOL GR2710

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TDS, SDS & Technical Documents

Technical Specifications

General Properties
ColorColor
Gold
Filler ContentFiller Content
81.7 %
Specific GravitySpecific Gravity
1.93
Electrical Properties
Volume ResistivityVolume Resistivity
10000000000000005 Ohms⋅cm
Physical Properties
Spiral Flow @ 175°CSpiral Flow @ 175°C
105 cm
Thermal Properties
Glass Transition Temperature (Tg)Glass Transition Temperature (Tg)
161 °C
UL 94 RatingUL 94 Rating
V0
Mechanical Properties
Molded ShrinkageMolded Shrinkage
0.14 %
Curing Conditions
Transfer PressureTransfer Pressure
40 - 85 kg/cm2
Transfer TimeTransfer Time
6 - 15 s

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