Hysol GR2320 | Black Epoxy Mold Compound

Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other

GR2320 Black Epoxy Mold CompoundHysol GR2320 | Black Epoxy Mold CompoundGR2320 Black Epoxy Mold Compound

Main features

  • For MnO Tantalum Capacitors
  • Black colored
  • Halogen-free version of MG33F-0602 & MG33F-0593

Product Description

Hysol GR2320 is a black semiconductor-grade epoxy molding compound designed for the encapsulation and protection of Manganese Oxide or MnO2 tantalum capacitors. This laser markable product is filled by 71% filler weight, has low ionic impurities and excellent thermal cycling performance.

Hysol GR2320 is an Environmentally "Green" product that replaces MG33F-0602 & MG33F-0593. Environmentally "green", meaning that it doesn't contain any halogens including bromine, antimony or phosphorus flame retardants. MG33F-0602 & MG33F-0593 dominated the space for tantalum capacitors but used halogen-containing flame retardants. This next generation epoxy mold compound replaces these older generation products.

Hysol GR2320 is designed to achieve JEDEC Level 1 requirements at 260°C reflow temperature on Maganese Oxide MnO2 capacitors. Its fast cure time also ensures that it is compatible with the latest automold manufacturing equipment while it also meets UL 94 V-0 Flammability at 1/4 inch (6.35mm) thickness.

 

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HYSOL GR2320

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TDS, SDS & Technical Documents

Technical Specifications

General Properties
ColorColor
Black
Filler ContentFiller Content
71 %
Specific GravitySpecific Gravity
1.8
Thermal Properties
Glass Transition Temperature (Tg)Glass Transition Temperature (Tg)
170 °C
Thermal ConductivityThermal Conductivity
0.7 W/m.K
UL 94 RatingUL 94 Rating
V0
Electrical Properties
Volume ResistivityVolume Resistivity
10000000000000000 Ohms⋅cm
Mechanical Properties
Molded ShrinkageMolded Shrinkage
0.25 %
Physical Properties
Spiral Flow @ 175°CSpiral Flow @ 175°C
76.2 cm
Curing Conditions
Transfer PressureTransfer Pressure
40 - 85 kg/cm2
Transfer TimeTransfer Time
6 - 15 s

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