DUROPTIX OE-6550

Harmonization Code : 3907.30.00.40 | Epoxy Mold Compounds containing by weight more than 70 % silicon dioxide

DUROPTIX OE-6550

Main features

  • 1:1 Controlled Mixing
  • High Optical Transmittance
  • High Refractive Index

Product Description

Duroptix™ OE-6550 A/B Kit is a two-part, 1:1 mix ratio silicone encapsulant formulated for LED packaging and encapsulation applications. Based on methylphenyl siloxane chemistry, this material combines high optical transparency, a refractive index of 1.54, and thermal stability for demanding lighting environments. The cured silicone exhibits 100% transparency at 450 nm (1 mm thickness) and is designed to accommodate stresses generated during thermal cycling, helping protect LED chips and bonding wires. Compatible with standard dispensing and molding processes, Duroptix™ OE-6550 A/B Kit supports efficient manufacturing while delivering optical and electrical properties required for LED device performance.

Key features

  • 100% transparency at 450 nm: High optical transmittance supports efficient light transmission in LED encapsulation applications.
  • High refractive index of 1.54: Provides optical characteristics suitable for LED packaging and light management designs.
  • Thermally stable silicone system: Designed to withstand thermal cycling and compatibility requirements associated with modern LED manufacturing processes.

Applications / Suitable for

  • LED encapsulation
  • LED package protection
  • Light-emitting diode manufacturing
  • Dispensing applications
  • Molding applications
Product Family

DUROPTIX OE-6550

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.

Technical Specifications

General Properties
ColorColor
Colorless
Component SystemComponent System
Two
Mix RatioMix Ratio
1 to 1
Refractive indexRefractive index
1.54
Specific GravitySpecific Gravity
1.15
Physical Properties
Young's modulusYoung's modulus
5.1 MPa
Mechanical Properties
ElongationElongation
75 %
Electrical Properties
Dielectric StrengthDielectric Strength
35 kV/mm

Additional Information

Technical properties

As-supplied / before-processing properties

Typical pre-processing properties for the two-part silicone encapsulant system.

Property Value Unit Method / condition
Product configuration Two-part - A/B kit
Mix ratio 1:1 - Part A : Part B
Color Colorless - As supplied
Viscosity (Part A) 23,600 cP Part A
Viscosity (Part B) 920 cP Part B
Mixed viscosity 3,800 cP Mixed material
Heat cure time 60 minutes 150°C
Technical properties

After-processing / final-state properties

Typical cured properties of the silicone encapsulant.

Property Value Unit Method / condition
Specific gravity 1.15 - Cured
Durometer 55 Shore A Cured
Tensile strength 1.3 MPa Typical cured value
Elongation 75 % Typical cured value
Volume resistivity 9E+15 ohm·cm Electrical property
Transparency 100 % 450 nm, 1 mm thick
Refractive index 1.54 - Optical property

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