DOWSIL X3-6211
Harmonization Code : 3910.00.00.90 | Silicones in Primary Forms; Others
Main features
- Rapid UV Encapsulation Cure
- 925 cP Application Viscosity
- 17 kV/mm Dielectric Strength
Product Description
DOWSIL™ X3-6211 Encapsulant is a one-part, clear, ultraviolet-curing silicone gel encapsulant for very fast processing of relatively flat and less complicated printed circuit-board assemblies. The ready-to-use material requires no mixing and has a typical viscosity of 925 cP, allowing flow across uncomplicated board geometry before UV exposure. It reaches 90% of gel hardness in approximately five seconds at an energy dose above 3,000 mJ/cm². After cure, the soft gel retains flexibility at very low temperatures and provides stress relief, electrical insulation, and a typical refractive index of 1.41.
Key features
- Five-second UV cure: The gel reaches 90% hardness in approximately five seconds above 3,000 mJ/cm².
- Low-viscosity one-part format: Typical viscosity is 925 cP with no mixing required.
- Flexible low-temperature gel: The cured material remains soft and flexible for stress relief.
Applications / Suitable for
- Fast potting of relatively flat PCB assemblies
- Electrical insulation of uncomplicated circuit boards
- Low-temperature stress-relief encapsulation
TDS, SDS & Technical Documents
Technical Specifications
No specifications available.
Additional Information
As-supplied / before-processing properties
Typical as-supplied or processing-state values unless otherwise stated. These values are not sales specifications.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Product form | One-part UV-curing gel | N/A | As supplied |
| Color | Clear | N/A | As supplied |
| Viscosity | 925 | cP | Typical |
| UV cure time | 5 | s | To 90% gel hardness at >3,000 mJ/cm² |
| Shelf life | 12 | months | At 25°C |
After-processing / final-state properties
Typical cured, installed, or in-use values under the stated conditions. These values are not sales specifications.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Gel hardness | 105 | g | Typical cured value |
| Penetration | 50 | 0.1 mm | Typical cured value |
| Refractive index | 1.41 | N/A | Typical cured value |
| Dielectric strength | 17 | kV/mm | Typical cured value |
