DOWSIL TC-5351
Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg
Main features
- 3.3 W/(m K) Thermal Interface
- Screen-Printable Thermal Interface
- Vertical Gap-Fill Capability Up to 1.0 mm
Product Description
DOWSIL™ TC-5351 Thermally Conductive Compound is a one-part, gray, non-curing thermal interface compound formulated to dissipate heat in electronics applications. It provides a typical thermal conductivity of 3.3 W/m·K and can fill vertical gaps up to 1.0 mm while remaining stable on vertical surfaces. The material is screen printable, requires no mixing or cure step, and can be stored at room temperature. These characteristics support controlled application between heat-generating components and associated housings, heat spreaders, or heat sinks in lighting, automotive electronics, power conversion, and other electronic thermal-management assemblies.
Key features
- Thermal conductivity: Typical value of 3.3 W/m·K for transferring heat across an electronic interface.
- Non-curing, one-part compound: Supplied ready to use without component mixing or a chemical cure cycle.
- Vertical gap filling: Demonstrates vertical gap-fill capability up to 1.0 mm.
- Screen printable: Supports controlled material placement in suitable electronics manufacturing processes.
- Room-temperature storage: Does not require refrigerated storage under the conditions established by Dow product information.
Applications / Suitable for
- Thermal interfaces in lighting and electronic assemblies
- Automotive electronic modules and power electronics
- Power conversion and EV charging equipment
Related application information
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Additional Information
DOWSIL™ TC-5351 Thermally Conductive Compound
A one-part, gray, non-curing thermal compound with a typical thermal conductivity of 3.3 W/m·K. It is formulated for heat dissipation in electronic interfaces and combines screen-printable application with stability on vertical surfaces and gap-fill capability up to 1.0 mm.
DOWSIL™ TC-5351 is supplied as a gray, one-part thermally conductive compound.
Product form and key characteristics
Typical product properties
The values below are typical product data and should not be interpreted as guaranteed specifications. Thermal conductivity is a bulk material property and does not independently define complete installed-interface or system performance.
| Property | Typical value | Unit |
|---|---|---|
| Thermal conductivity | 3.3 | W/m·K |
| Specific gravity | 3.1 | — |
| Vertical gap-fill capability | Up to 1.0 | mm |
| Component count | 1 | part |
Applying the thermal compound
DOWSIL™ TC-5351 is a one-part, non-curing material that can be screen printed or otherwise applied using equipment appropriate for its compound form. The applied quantity and resulting interface thickness should be controlled for the intended assembly rather than selected from thermal conductivity alone.
A non-curing thermally conductive compound applied to a processor helps fill surface irregularities and improve heat transfer between the component and heat sink
Store DOWSIL™ TC-5351 in its original packaging with the container tightly closed to prevent contamination. Follow any additional storage instructions specified on the product label and use the product within the indicated shelf life.
Electronic thermal-management applications
The product is formulated to dissipate heat in lighting, automotive, and power-electronics applications. Final interface thickness, assembly design, operating environment, and required thermal performance should be evaluated in the intended system.
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Thermal-management application resources
How to use thermally conductive materials
Evaluate DOWSIL™ TC-5351 for your thermal interface
Contact Krayden to discuss interface geometry, target application thickness, dispensing or screen-printing requirements, vertical placement, sample needs, and the role of DOWSIL™ TC-5351 in lighting, automotive, power-conversion, or EV charging electronics.
Discuss your thermal interface requirements
Krayden can support evaluation of DOWSIL™ TC-5351 for thermal management applications and help identify suitable material solutions for your electronic assembly requirements.
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