DOWSIL TC-5021
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- One-Part Non-Curing Thermal Compound
- 0.2 deg C cm^2/W Thermal Resistance
- 82,650 cP Application Viscosity
Product Description
DOWSIL™ TC-5021 Thermally Conductive Compound is a one-part, gray, flowable, non-curing silicone thermal-interface compound for transferring heat from microprocessor units and printed circuit-board assemblies to heat sinks or chassis. The filled polydimethylsiloxane material requires no curing oven and is formulated for thin bond lines, low thermal resistance, and printability. Typical as-supplied properties include 82,650 cP viscosity, 3.47 specific gravity, 0.15% bleed, and 99.8% non-volatile content. In use, the compound provides typical thermal conductivity of 3.3 W/m·K and thermal resistance of 0.2°C·cm²/W at 40 psi.
Key features
- Non-curing thermal interface: The compound is installed without cure processing or curing ovens.
- Thin bond-line capability: The flowable grease supports low thermal resistance between devices and heat sinks.
- 3.3 W/m·K thermal conductivity: Typical thermal resistance is 0.2°C·cm²/W at 40 psi.
Applications / Suitable for
- Cooling microprocessor units in servers
- Desktop computer thermal interfaces
- Notebook computer thermal interfaces
TDS, SDS & Technical Documents
Technical Specifications
No specifications available.
Additional Information
As-supplied / before-processing properties
Typical as-supplied or processing-state values unless otherwise stated. These values are not sales specifications.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Product form | One-part non-curing compound | N/A | As supplied |
| Color | Gray | N/A | As supplied |
| Viscosity | 82,650 | cP | Typical |
| Specific gravity | 3.47 | N/A | Uncured |
| Bleed | 0.15 | % | Typical |
| Non-volatile content | 99.8 | % | Typical |
After-processing / final-state properties
Typical cured, installed, or in-use values under the stated conditions. These values are not sales specifications.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Thermal conductivity | 3.3 | W/m·K | Typical in-use property |
| Thermal resistance | 0.2 | °C·cm²/W | At 40 psi |
| Dielectric strength | 5 | kV/mm | Typical |
| Volume resistivity | 3.7 × 10¹¹ | ohm·cm | Typical |
| Dielectric constant | 8.1 | N/A | At 1 kHz |
| Dissipation factor | 0.06 | N/A | At 1 kHz |
