DOWSIL TC-2030 THERMALLY CONDUCTIVE ADHESIVE
Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg
Main features
- 2.7 W/(m K) Thermal Bonding
- Two-Part Heat-Cure Adhesive
- Electrical-Insulation Thermal Bonding
Product Description
DOWSIL™ TC-2030 Adhesive is a two-part, heat-curing, thermally conductive silicone adhesive engineered for bonding electronic components while providing efficient heat transfer and electrical insulation. It offers 2.7 W/m·K thermal conductivity, 21 kV/mm dielectric strength, and a 1:1 mix ratio, curing into a durable silicone elastomer with excellent adhesion to aluminum, copper, ceramics, and other common electronic substrates. This makes it suitable for power electronics, PCB assemblies, LED modules, telecommunications equipment, and other heat-generating electronic devices requiring reliable thermal management and structural bonding.
Key features
- Two-part heat-curing system - supplied as a 1:1 mix ratio adhesive that cures without producing by-products, making it suitable for deep-section and confined bonding applications.
- High thermal conductivity - provides 2.7 W/m·K thermal conductivity to efficiently transfer heat from electronic components to heat sinks and cooling structures.
- Strong adhesion - develops excellent primerless adhesion to copper, aluminum, ceramics, epoxy laminates, and many engineering materials.
- Electrical insulation - combines thermal conductivity with approximately 21 kV/mm dielectric strength and high volume resistivity for electrically insulating thermal interfaces.
- Mechanical stability - cures into a durable silicone elastomer with 92 Shore A hardness, providing reliable mechanical support for bonded assemblies.
- Deep-section curing capability - addition-cure chemistry enables uniform curing throughout thick or confined sections without generating cure by-products.
- Manual or automated dispensing - compatible with manual dispensing and automated needle dispensing equipment for production manufacturing.
Applications
DOWSIL™ TC-2030 Adhesive is suitable for electronic assemblies requiring structural bonding, thermal management, and electrical insulation in a single adhesive system.
- Power electronics: bonds power modules, MOSFETs, IGBTs, converters, and power supply components while transferring heat to heat sinks.
- PCB assemblies: provides thermal bonding for populated circuit boards, electronic modules, and heat-generating components.
- LED lighting systems: improves thermal transfer between LED modules and aluminum heat sinks to support long-term lighting reliability.
- Telecommunications equipment: suitable for RF modules, communication devices, networking equipment, and other electronics requiring continuous thermal management.
- Electronic component bonding: bonds electrical components, metal housings, ceramic substrates, and heat spreaders where both adhesion and heat dissipation are required.
Additional information
- Designed for manual dispensing or automated needle dispensing equipment in electronics manufacturing.
- Heat-cure addition chemistry produces no cure by-products, enabling reliable curing in deep or confined bond lines.
- Typical cure is achieved in approximately 60 minutes at 130°C, with faster curing possible at higher temperatures for thin bond lines.
- Provides long-term operating capability across a typical silicone service temperature range of -45°C to 200°C, depending on application requirements.
- Substrate compatibility and adhesion testing are recommended prior to production to optimize bond strength and thermal performance.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Physical Properties
Mechanical Properties
Electrical Properties
Thermal Properties
Additional Information
Why choose DOWSIL™ TC-2030
Two-part thermal adhesive for stable electronic bonding
Thermal transfer and bonding
Provides 2.7 W/m·K thermal conductivity while bonding electrical components and boards to support efficient heat dissipation.
Deep-section cure capability
Addition-cure chemistry produces no cure by-products, allowing use in confined or deeper bond sections where moisture-cure systems may be limited.
Strong mechanical support
Cures to a durable 92 Shore A silicone elastomer with good adhesion to aluminum, copper, ceramics, and electronic substrates.
Processing summary
Heat-cure processing for electronics manufacturing
- Application: Manual or automated needle dispensing.
- Mix ratio: Two-part system with a 1:1 mix ratio.
- Cure mechanism: Addition-cure silicone adhesive with no cure by-products.
- Typical cure: Approximately 60 minutes at 130°C.
- Recommendation: Thoroughly mix Part A and Part B before use; light-colored streaks or marbling may indicate incomplete mixing.
- De-airing: Vacuum de-airing may be used when void reduction is required.
- Validation: Confirm adhesion, cure, bond-line thickness, and thermal performance on actual production substrates.
Frequently Asked Questions
FAQ
What is DOWSIL™ TC-2030 used for?
It is used for bonding electrical components and boards while providing efficient thermal transfer and electrical insulation.
Does DOWSIL™ TC-2030 require mixing?
Yes. It is a two-part adhesive with a 1:1 mix ratio. Proper mixing is required before dispensing and heat curing.
How does it cure?
DOWSIL™ TC-2030 is a heat-cure addition silicone adhesive. A typical cure schedule is 60 minutes at 130°C.
Is it electrically insulating?
Yes. It provides thermal conductivity together with high electrical insulation, including typical dielectric strength of 21 kV/mm.
Which substrates can it bond to?
It provides good primerless adhesion to many common substrates, including aluminum, copper, ceramics, epoxy laminate boards, reactive materials, and filled plastics. Substrate testing is recommended before production.
Need help with a thermally conductive adhesive?
Our technical team can assist with material selection, mix and dispense recommendations, bond-line design, substrate compatibility, cure validation, and thermal performance review for your electronic assembly.
Contact Our Technical Team
