DOWSIL SE 9189 L
Harmonization Code : 3208.20.90 | Paints and varnishes that are dispersed or dissolved in a non aqueous medium
Main features
- One-Part Flowable RTV Silicone Adhesive
- Eight-Minute Tack-Free Time
- 25 kV/mm Dielectric Strength
Product Description
DOWSIL SE 9189 L RTV Adhesive is a one-part gray or white moisture-cure silicone with flowable rheology for electronics assembly. Typical viscosity is 22,000 cP and tack-free time is 8 minutes at 25 deg C before the material cures to a soft elastomer with documented mechanical and dielectric properties. The product supports needle dispensing and flow application and is used for circuit-board component fixing, vibration dampening, and sealing.
Key features
- Flow and dispensing: One-part flowable RTV silicone with typical 22,000 cP viscosity for needle dispensing or flow application.
- Processing window: Typical tack-free time is 8 minutes at 25 deg C under the documented moisture-cure process.
- Electrical performance: Typical cured properties include Shore A 33 hardness, 220% elongation, 2.0 MPa tensile strength, and 25 kV/mm dielectric strength.
Applications
- Circuit-board component fixing
- Vibration dampening
- Sealing
Technical Specifications
General Properties
Physical Properties
Mechanical Properties
Electrical Properties
Additional Information
Electronics Assembly Adhesives
Flowable one-part RTV silicone for fixing, damping, and sealing
DOWSIL SE 9189 L RTV Adhesive is a one-part gray or white moisture-cure silicone with flowable rheology for electronics assembly. The product has a typical viscosity of 22,000 cP and 8-minute tack-free time at 25 deg C, then cures to a soft elastomer with documented mechanical and dielectric properties.
As-Supplied Properties
Flowable one-part silicone before cure
The material is supplied as a single-component gray or white silicone with a typical viscosity of 22,000 cP and flowable application behavior.
| Property | Typical Value | Unit / Condition | State |
|---|---|---|---|
| Component count | One | - | As supplied |
| Color | Gray or white | - | As supplied |
| Viscosity | 22,000 | cP | As supplied |
| Low molecular weight siloxane, D4-D10 | 20 | ppm | As supplied / product value |
| Low molecular weight siloxane, D4-D20 | 110 | ppm | As supplied / product value |
Processing
Dispense or flow onto prepared surfaces and allow moisture cure
SE 9189 L supports needle dispensing and flow application. Surface preparation and access to atmospheric moisture remain important to adhesion and through-cure.
- Clean the surfaces:Thoroughly clean or degrease bonding surfaces using a suitable method for the actual substrate. Residual oils can interfere with adhesion.
- Apply the material:Use automated or manual needle dispensing, or a flow application method, according to the required fixing, damping, or sealing geometry.
- Allow surface cure:Typical tack-free time is 8 minutes at 25 deg C. Cure progresses from the exposed surface inward because the one-part system relies on moisture in the air.
- Accelerate when appropriate:Mild heat below 60 deg C can accelerate the moisture-cure process when appropriate.
Storage & Handling
Exclude moisture before use
Store at or below the temperature shown on the product label, keep the original container tightly closed, and minimize headspace. For partially filled containers, purge with dry air or another dry gas such as nitrogen and use the product by the label Use Before date.
Technical Guidance
Control substrate condition, cure depth, and service exposure
The product is flowable, but final bond or seal performance still depends on the actual substrate, joint geometry, and moisture-cure environment.
Test the actual substrate
Test the actual substrate because surface chemistry and contamination can change adhesion. A lap-shear or similar test can be used to evaluate compatibility and minimum cure time.
Avoid unsupported deep-section assumptions
One-part moisture-cure silicones cure from the exposed surface inward and are not typically used in highly confined spaces or where deep-section cure is required.
Keep solvent exposure intermittent
The supplied guidance is for splash or intermittent solvent exposure rather than continuous solvent or fuel exposure. Confirm the actual fluid and exposure condition before use.
Final-State Properties
Typical cured and bonded performance
The table reports cured mechanical and electrical properties and preserves the documented bonded glass test configuration where applicable.
| Property | Typical Value | Unit / Test Condition | State |
|---|---|---|---|
| Specific gravity | 1.19 | Cured | Cured material |
| Lap shear adhesion | 120 | N/cm2 on glass | Bonded test |
| Tensile strength | 2.0 | MPa | Cured material |
| Elongation | 220 | % | Cured material |
| Durometer | 33 | Shore A | Cured material |
| Dielectric strength | 25 | kV/mm | Cured material |
| Volume resistivity | 9.0 E+14 | ohm-cm | Cured material |
| Dielectric constant | 3.1 | at 1 MHz | Cured material |
| Dissipation factor | 0.0004 | at 1 MHz | Cured material |
Applications
Documented electronics assembly uses
SE 9189 L is positioned for fixing, vibration management, and sealing functions on electronic assemblies.
Circuit-board component fixing
Flowable RTV adhesive for fixing parts on circuit boards where a soft cured silicone is appropriate.
Vibration dampening
Application around supported electronic parts to provide a soft elastomeric material for vibration-dampening use.
Sealing
Flowable silicone sealing around supported electronics interfaces and assemblies.
Technical support for DOWSIL SE 9189 L RTV Adhesive
Need help evaluating SE 9189 L for component fixing, vibration dampening, or a sealing joint? Krayden can help review substrate preparation, dispense or flow application, section geometry, moisture-cure conditions, and the mechanical or dielectric properties required by the intended electronics assembly.
