DOWSIL SE 4485
Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg
Main features
- 2.8 W/(m K) Thermal Conductivity
- One-Part Moisture-Cure Silicone
- Thermal-Bonding Electrical Insulation
Product Description
DOWSIL™ SE 4485 Thermally Conductive Adhesive is a one-part, white, semi-flowable silicone adhesive formulated for sealing, bonding and heat dissipation in electronic assemblies such as telecommunications devices and power-supply modules. The material cures at room temperature through exposure to atmospheric moisture and provides typical 2.8 W/m·K thermal conductivity, 10-minute tack-free time at 25°C, 1.2 MPa lap-shear adhesion, 90 Shore A hardness and 3.4 MPa tensile strength. Joint geometry, adhesive thickness, humidity, temperature and access to atmospheric moisture must be controlled because tack-free time is not full-depth cure.
Key features
- One-part, ready-to-use thermally conductive silicone adhesive
- Room-temperature moisture cure with no component mixing
- Typical 2.8 W/m·K thermal conductivity
- Fast 10-minute tack-free time at 25°C
- Semi-flowable white material for sealing and bonding
- Typical 1.2 MPa lap-shear adhesion and 3.4 MPa tensile strength
- UL 94 V-0 positioning, subject to the current recognised formulation and construction
Applications
- Telecommunications-electronics sealing and bonding
- Power-supply module thermal bonding and sealing
- Heat dissipation between electronic components and compatible substrates
- Moisture-accessible thermal-interface joints
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Physical Properties
Electrical Properties
Thermal Properties
Additional Information
DOWSIL™ SE 4485 Thermally Conductive Adhesive
A white, semi-flowable silicone adhesive developed for sealing, bonding and thermal transfer in telecommunications devices, power-supply modules and other electronic assemblies. It cures through atmospheric moisture, so production design must provide sufficient exposed perimeter and time for cure to progress through the adhesive.
Ready-to-use white semi-flowable adhesive
| Property | Typical value | Context |
|---|---|---|
| Number of parts | One | No mix ratio. |
| Colour and flow | White, semi-flowable | Dispensing depends on package and equipment conditions. |
| Non-volatile content | 99.2% | Legacy TDS value; confirm current revision. |
| Tack-free time at 25°C | 10 minutes | Surface cure, humidity dependent. |
| Fluidity | 54 mm | Legacy TDS result; verify method. |
Prepare surfaces, dispense, assemble and provide moisture access
- Remove oils, dust, release agents and incompatible residues.
- Validate adhesion on each exact substrate and coating.
- Control nozzle, pressure, speed, temperature, deposit volume and bondline thickness.
- Keep sufficient adhesive perimeter exposed to atmospheric moisture.
- Do not treat the 10-minute tack-free time as full-depth cure.
- Validate cure time for humidity, temperature, thickness and confinement.
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Storage, safety and regulatory control
Keep the container tightly closed and follow the current Dow package label and TDS to prevent premature moisture exposure. The SDS and Regulatory Document were identified but not readable in this workspace. Confirm their dates, revisions, region and exact compliance scope before publication. Do not infer broad RoHS, REACH, PFAS-free, halogen-free, medical, food-contact or other claims.
Thermal, mechanical, adhesion and electrical properties
Typical values are not specifications. Installed performance depends on cure depth, bondline thickness, area, substrate preparation, joint geometry and environment.
| Property | Typical value | Context |
|---|---|---|
| Specific gravity | 2.9 | Cured material. |
| Thermal conductivity | 2.8 W/m·K | Bulk property. |
| Hardness | 90 Shore A | Firm cured silicone. |
| Tensile strength | 3.4 MPa | Official Dow product-page value. |
| Elongation at break | 25% | Official Dow product-page value. |
| Lap-shear adhesion | 1.2 MPa | Current Dow page states aluminium; legacy TDS states glass. Confirm. |
| Dielectric strength | 19 kV/mm | Breakdown property, not working voltage. |
| Volume resistivity | 8 × 1014 ohm-cm | Legacy TDS value; confirm current TDS. |
| Dielectric constant | 5.6 at 1 MHz | Legacy TDS value. |
| Dissipation factor | 0.005 at 1 MHz | Legacy TDS value. |
Design atmospheric-moisture access into the thermal bond
Supported uses include heat dissipation, sealing, bonding and thermal-interface service in telecommunications devices and power-supply modules. Wide, thick or fully confined joints may cure slowly because moisture must migrate inward from exposed surfaces. Qualification should establish cure depth, adhesion, installed thermal resistance, electrical spacing, movement and environmental durability.
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Validate DOWSIL™ SE 4485 for your moisture-cure thermal bond
Krayden can help review surface preparation, dispensing, bondline thickness, humidity, exposed cure perimeter, tack-free versus full-depth cure, adhesion, installed thermal resistance, electrical design and regulatory documentation.
