DOWSIL EE-1010 LOW VISCOSITY ENCAPSULANT

Main features

Low-Viscosity Encapsulant Application
Controlled Cure Flexibility
Firm Elastomeric Electrical Protection

Product Description

DOWSIL™ EE-1010 Low Viscosity Encapsulant Kit is a two-part, 1:1 mix polydimethylsiloxane silicone elastomer for protecting electrical PCB assemblies. Its typical mixed viscosity of 840 mPa·s and extended working time support flow through narrow spaces while providing additional time for entrapped air to rise and break in complex board and component geometries. The material can be dispensed manually or through meter-mixing equipment and cured at room temperature or accelerated with heat. After cure, it forms a flexible 60 Shore A elastomer with documented dielectric properties and moderate thermal conductivity, making it suitable for complex assemblies and manufacturing processes involving frequent starts and stops.

Key features

Low mixed viscosity: A typical mixed viscosity of 840 mPa·s supports flow and filling through narrow spaces in complex PCB assembly geometries.
Extended working time: A typical pot life of 50 minutes at 25°C provides additional processing time for air displacement and start-stop manufacturing operations.
Flexible cure schedules: The material can be cured for 24 hours at 25°C or heat accelerated to 3 minutes at 100°C or 2 minutes at 150°C.
1:1 two-part processing: The equal mix ratio supports manual or meter-mix dispensing, while contrasting component colors assist visual identification during mixing.
Electrical and mechanical protection: The cured elastomer has a typical hardness of 60 Shore A, dielectric strength of 18 kV/mm, and volume resistivity of 1.19 × 1015 ohm·cm.

Applications / Suitable for

Protection and encapsulation of electrical PCB system assemblies
Complex boards and component layouts containing narrow spaces
Manufacturing processes involving frequent starts and stops
Assemblies requiring additional time for entrapped air to rise and break before cure

Related resources

Encapsulants and Gels Selection Guide

TDS, SDS & Technical Documents

Technical Specifications

Thermal Properties

Thermal Conductivity

0.35 W/m.K

Electrical Properties

Dielectric Strength

18 kV/mm

Volume Resistivity

1.19E15 Ohms⋅cm

Additional Information

Potting, Encapsulants and Underfills

DOWSIL EE-1010 Low Viscosity Encapsulant Kit

DOWSIL EE-1010 is a two-part, 1:1 addition-cure polydimethylsiloxane silicone elastomer for protecting electrical PCB system assemblies. Low-viscosity flow and a 50-minute pot life at 25 deg C support complex board geometries and manufacturing with frequent starts and stops, while room-temperature and heat-accelerated cure options provide flexible process timing.

Two-part silicone elastomer1:1 mix ratioLow-viscosity flowFlexible cured elastomerModerate thermal conductivity

Technical properties

Typical as-supplied properties

Values are typical and are not intended for use in preparing specifications. Component states are kept separate.

DOWSIL EE-1010 typical component properties
Property	Value	Unit	Method / condition
Mix ratio	1 to 1	-	Typical product ratio
Viscosity, Part A	1020	mPa s	Typical as-supplied value
Viscosity, Part B	600	mPa s	Typical as-supplied value
Specific gravity, uncured Part A	1.26	-	Typical as-supplied value
Specific gravity, uncured Part B	1.25	-	Typical as-supplied value

Processing

Mixing, dispensing and cure

Cure begins when Parts A and B are mixed. Accurate proportioning, thorough mixing, air management, surface preparation when adhesion is required, and the selected cure temperature are the main process controls for EE-1010.

Working time: Typical pot life is 50 minutes at 25 deg C. Dow defines pot life as the time required for viscosity to double after Parts A and B are mixed. The TDS also lists a 4.2 hour snap time at 25 deg C.

Cure schedule: Published cure times are 24 hours at 25 deg C, 3 minutes at 100 deg C, and 2 minutes at 150 deg C. The product can be room-temperature cured or heat accelerated.

Dispensing: Thoroughly mixed material may be poured or dispensed directly into the container in which it will cure. The product can be dispensed manually or through meter-mixing equipment.

Air management: Minimize air entrapment during pouring or dispensing. Dow recommends dispensing under vacuum when practical, particularly for assemblies with many small voids, or evacuating the unit after dispensing when needed.

Adhesion preparation: The 2023 Dow selection guide lists EE-1010 as a standard encapsulant. Where adhesion is required, Dow's standard-encapsulant guidance calls for good cleaning and a primer, applied as a thin uniform coat and fully cured before encapsulation.

Storage and Handling

Use the product before the date shown on the label and follow the labeled storage-temperature requirements. Keep containers tightly closed, minimize headspace, and prevent moisture contact. For partially filled containers, Dow recommends purging the headspace with dry air or nitrogen before resealing.

Final-state properties

Typical cured electrical and thermal properties

These values describe the cured material and are typical, not guaranteed design values. Dielectric strength is a material test property and should not be treated as an assembly working-voltage rating.

DOWSIL EE-1010 typical cured properties
Property	Value	Unit	Method / condition
Dielectric strength	18	kV/mm	Typical cured value; test method not stated in supplied TDS
Volume resistivity	1.19E+15	ohm cm	Typical cured value; test method not stated in supplied TDS
Dielectric constant	3.17	-	At 100 kHz and 1 MHz
Thermal conductivity	0.35	W/(m K)	Typical cured value; test method not stated in supplied TDS
Linear CTE	300	ppm/deg C	By TMA

Technical guidance

Cure compatibility and repair

Material compatibility and repair method can materially affect processing. Use the supplier guidance below as evaluation controls rather than universal guarantees for every assembly.

Cure-inhibition screening

Addition-cure silicones can be inhibited by certain organotin or other organometallic compounds, sulfur-containing materials, unsaturated hydrocarbon plasticizers, and some solder-flux residues. For questionable materials, Dow recommends a small-scale compatibility test before production processing.

Repair and repotting

Dow describes silicone encapsulants as selectively removable for repair, depending on the removal method and technique. Cut and remove unwanted cured material, mechanically clean adhered residue as needed, roughen the exposed cured encapsulant, rinse with a suitable solvent, dry, and repot with additional product. Silicone prime coats are not recommended for adhering the product to cured silicone.

Applications

Electronics protection applications

EE-1010 is intended for PCB assembly encapsulation where low-viscosity flow, an extended working window, and flexible silicone protection are useful process and application considerations.

PCB assembly protection

When the two liquid components are thoroughly mixed and cured, EE-1010 forms a flexible elastomer intended for protection of electrical PCB system assemblies.

Complex board geometries

Low viscosity supports flow and filling through narrow spaces, while the extended working time gives entrapped air more time to be displaced, rise to the surface, and break in complex board and component layouts.

Start-stop manufacturing

Dow specifically positions EE-1010 for manufacturing processes with frequent starts and stops, where the 50-minute pot life provides a longer working window before cure advances.

Product resources

Encapsulants and Gels Selection Guide

This 2023 Dow selection guide places EE-1010 within the standard encapsulant portfolio and provides portfolio-level comparison of flow class, cure system, working time, cure options, physical properties, and dielectric strength for product screening.

Selection guide

Dow silicone encapsulants and gels

Use the guide to compare EE-1010 with other Dow encapsulants and gels by processing profile and product characteristics. Product-specific qualification should remain tied to the intended assembly and current supplier data.

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Next steps

Evaluate DOWSIL EE-1010 for your PCB encapsulation process

Krayden can help review board geometry, mixing and dispensing approach, working time, cure temperature, air-management strategy, adhesion requirements, cure-inhibition risks, dielectric needs, and rework considerations for evaluating EE-1010 in an electronics protection process.