DOWSIL 3-6635 CLEAR DIELECTRIC GEL

DOWSIL™ 3-6635 Dielectric Gel is a one-part, heat-curable silicone dielectric gel designed to protect sensitive electronic assemblies operating in demanding environments, including extreme low-temperature applications. It provides 700 cP viscosity, 20 kV/mm dielectric strength, and operating capability from -80°C to 200°C, while curing into an ultra-soft, resilient gel that cushions delicate components against thermal and mechanical stress. This makes it suitable for PCB assemblies, electrical insulation, encapsulation, and high-voltage electronics requiring long-term environmental protection and stress relief, subject to application-specific testing and qualification.

Key features

• One-part silicone gel - supplied as a ready-to-use material with no mixing required, reducing processing complexity and minimizing mixing errors.
• Excellent low-temperature performance - remains flexible and resilient across a wide operating temperature range from -80°C to 200°C, helping protect electronics exposed to severe thermal cycling.
• Heat-curing system - cures under heat with a typical gel time of approximately 10.8 minutes at 135°C, supporting efficient manufacturing processes.
• Low viscosity for easy dispensing - approximately 700 cP viscosity enables good flow beneath components and into complex geometries using manual or automated dispensing equipment.
• Soft stress-relieving gel - cures into an extremely soft, self-healing silicone gel that helps absorb thermal expansion mismatch (CTE) while reducing mechanical stress on sensitive electronic components.
• High electrical insulation - provides approximately 20 kV/mm dielectric strength, low dielectric constant, and high volume resistivity for reliable electrical insulation in high-voltage electronic assemblies.
• Environmental protection - helps isolate circuits from moisture, contaminants, and environmental exposure while maintaining long-term electrical performance.

Applications

DOWSIL™ 3-6635 Dielectric Gel is suitable for electronic assemblies requiring soft silicone encapsulation, electrical insulation, moisture protection, and mechanical stress relief, particularly in applications exposed to extreme temperature environments.

• Printed circuit board (PCB) encapsulation: provides protective encapsulation for PCB assemblies while cushioning delicate electronic components.
• High-voltage electrical insulation: suitable for power electronics, electrical modules, connectors, and assemblies requiring reliable dielectric insulation.
• Low-temperature electronics: supports aerospace, defense, scientific instrumentation, and industrial electronics operating under severe cold environments where flexibility must be maintained.
• Stress-sensitive electronic assemblies: helps reduce thermal and mechanical stresses caused by coefficient of thermal expansion (CTE) mismatch between components and substrates.
• Optoelectronic devices: suitable for optoelectronic assemblies where long-term optical stability and stress relief are important.

Additional information

• Compatible with manual dispensing and automated dispensing equipment.
• The cured gel remains soft and resilient, allowing localized repair or component replacement when required using appropriate silicone removal procedures.
• Storage life is typically 6 months at 25°C when stored in the original unopened container.
• As with all silicone encapsulants, compatibility testing with substrates, flux residues, curing agents, and surrounding materials is recommended before production implementation.