DOWSIL 1-4173 THERMALLY CONDUCTIVE ADHESIVE
Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg
Main features
- One-Part Heat-Cure Thermal Bonding
- 1.8 W/(m K) Thermal Bonding
- Primerless Thermal Bonding Processing
Product Description
DOWSIL™ 1-4173 Thermally Conductive Adhesive is a one-part, heat-curable silicone adhesive engineered to provide both strong mechanical bonding and efficient heat dissipation in demanding electronic assemblies. Its flowable, self-leveling formulation simplifies dispensing while ensuring excellent contact with components to minimize thermal resistance and improve long-term reliability.
Key features
- High bond strength - with primerless adhesion to metals, ceramics, epoxy laminates, and many engineering plastics.
- Flowable and self-leveling - for consistent coverage of complex geometries.
- Heat-curable - with flexible cure schedules (20 minutes at 150°C, 30 minutes at 125°C, or 90 minutes at 100°C).
- Solvent-free formulation - with no cure by-products, making it ideal for deep-section or confined applications.
- Reliable operation from -45°C to 200°C - for demanding industrial and automotive environments.
Applications
DOWSIL™ 1-4173 Thermally Conductive Adhesive is suitable for electronic assemblies requiring both structural bonding and efficient thermal management, where reliable heat dissipation, durable adhesion, and long-term environmental stability are critical.
- Heat sink attachment: provides strong mechanical bonding while efficiently transferring heat from power devices to heat sinks.
- Integrated circuit (IC) substrate bonding: securely bonds semiconductor packages and substrates while minimizing thermal resistance.
- Base plate attachment: enhances thermal conduction and structural integrity in power modules and electronic assemblies.
- Lid and housing attachment: forms durable, thermally conductive bonds between device lids, enclosures, and heat spreaders.
- Power electronics and PCB assemblies: improves thermal management and reliability in industrial, automotive, telecommunications, and consumer electronic applications.
- Automated and manual dispensing processes: the flowable, self-leveling formulation enables consistent dispensing and complete coverage of complex component geometries.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Physical Properties
Thermal Properties
Additional Information
DOWSIL™ 1-4173 Thermally Conductive Adhesive
DOWSIL™ 1-4173 Thermally Conductive Adhesive is a one-part, gray, flowable, heat-curable silicone adhesive designed for electronic assemblies requiring both structural bonding and thermal management. It provides good thermal conductivity, high tensile strength, primerless adhesion to many common substrates, and reliable heat transfer for PCB systems, heat sinks, base plates, lids, and housings.
Thermal bonding with structural adhesion
- One-part silicone adhesive with no mixing of separate components required.
- 1.8 W/m·K thermal conductivity supports heat transfer from components to heat sinks or housings.
- Flowable and self-leveling behavior supports good wetting after dispensing.
- Primerless adhesion to many metals, ceramics, epoxy laminates, reactive materials, and filled plastics.
- No added solvents and no cure by-products.
- Suitable for automated or manual dispensing processes.
Heat-cure silicone adhesive
Process points to confirm before qualification
- Apply to clean and dry substrates.
- Remove oils, greases, oxide films, mold-release agents, dust, and other contaminants.
- Validate adhesion on the actual metal, ceramic, laminate, plastic, or coated surface.
- Review manual or automated dispensing process for the target bond area.
- Control dispense volume, bond-line thickness, and placement accuracy.
- Avoid trapped air, incomplete wetting, or excessive squeeze-out.
- Use heat cure at 100°C or above.
- For thicker or confined sections, consider a pre-cure at 70°C as a starting point.
- Confirm final cure, adhesion, and thermal performance on the actual assembly.
- Minimize unnecessary bond-line thickness to reduce thermal resistance.
- Confirm heat path from component to heat sink, base plate, or housing.
- Verify performance under expected operating temperature, humidity, vibration, and thermal cycling.
Where DOWSIL™ 1-4173 fits
Frequently asked questions about DOWSIL™ 1-4173 Thermally Conductive Adhesive
What is DOWSIL™ 1-4173 used for?
It is used for thermal bonding applications such as heat sink attachment, IC substrate bonding, base plate attach, and lid or housing attachment in electronic assemblies.
Is DOWSIL™ 1-4173 a one-part or two-part adhesive?
It is a one-part silicone adhesive, so no mixing of separate components is required before dispensing.
How does this adhesive cure?
DOWSIL™ 1-4173 is heat cured. Typical cure options are 90 minutes at 100°C, 30 minutes at 125°C, or 20 minutes at 150°C.
What is the thermal conductivity of DOWSIL™ 1-4173?
The typical thermal conductivity is 1.8 W/m·K.
What substrates can it bond?
It can develop primerless adhesion to many common substrates including metals, ceramics, epoxy laminate boards, reactive materials, and filled plastics. Adhesion should be verified on the actual production substrate.
What safety points should be considered before handling?
Review the current SDS before handling. The SDS notes eye irritation classification and recommends appropriate eye protection, ventilation, and moisture-control precautions during storage and handling.
