COOLTHERM SC-6709
Harmonization Code : 3910.00.00.90 | Silicones in Primary Forms; Others
Main features
- 1.0 W/(m K) Thermal Encapsulation
- Three Hardener Options
- 68 to 205 deg C Service Range
Product Description
CoolTherm® SC-6709 Silicone Encapsulant is a two-component, solvent-free RTV silicone system for thermally conductive potting and encapsulation. The white SC-6709 resin may be combined with CoolTherm SC-6731, CoolTherm SC-6730, or Circalok™ 6732 hardener to provide different mix ratios and room-temperature cure times. After cure, the flexible silicone provides typical thermal conductivity of 1.0 W/m·K, dielectric strength of 21.7 kV/mm, and a documented operating-temperature range from -68°C to +205°C.
Key features
- Thermally conductive encapsulation: Provides typical cured thermal conductivity of 1.0 W/m·K using the Hot Disc Transient Method, ISO 22007-2.
- Multiple hardener options: Compatible with CoolTherm SC-6731, CoolTherm SC-6730, and Circalok 6732 hardeners for configurable mix ratios and cure times.
- Broad operating-temperature range: Suitable for parts and devices experiencing temperatures from -68°C to +205°C.
Applications / Suitable for
- Thermally conductive potting and encapsulation
- Applications requiring flexible silicone encapsulation and high-temperature service
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Physical Properties
Additional Information
As-supplied / before-processing properties
Typical properties of CoolTherm SC-6709 resin and its supported resin-to-hardener systems before cure. Values are not intended for specification purposes.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Appearance | White liquid | — | CoolTherm SC-6709 resin as supplied |
| Viscosity | 32,000 | cP | CoolTherm SC-6709 resin at 25°C; test method not stated |
| Specific gravity | 1.80 | — | CoolTherm SC-6709 resin at 25°C |
| Mix ratio by weight | 100:0.5 / 100:5 or 100:10 / 100:0.5 | Resin:hardener | SC-6731 / SC-6730 / Circalok 6732 hardener, respectively |
| Gel time | 1–2 / 0.5–1 / 2–3 | hours | At 25°C with SC-6731 / SC-6730 / Circalok 6732 hardener, respectively; both SC-6730 mix ratios have the same stated range |
| Cure time | 12–16 / 8–12 / 6–8 | hours | At 25°C with SC-6731 / SC-6730 / Circalok 6732 hardener, respectively; both SC-6730 mix ratios have the same stated range |
| Shelf life | 6 | months | CoolTherm SC-6709 resin stored at 25°C in the original, unopened container |
After-processing / final-state properties
Typical cured properties of CoolTherm SC-6709 silicone systems. The cured properties are stated to be the same regardless of the supported hardener used. Values are not intended for specification purposes.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Thermal conductivity | 1.0 | W/m·K | Hot Disc Transient Method, ISO 22007-2 |
| Coefficient of linear thermal expansion | 50 | ppm/°C | Test method and temperature region not stated |
| Hardness | 50 | Shore A | Test method not stated |
| Tensile strength | 2.14 (310) | MPa (psi) | At 25°C; test method not stated |
| Elongation at break | 115 | % | Test method and test temperature not stated |
| Moisture absorption | 0.08 | % | 10 days at 25°C; exposure medium and test method not stated |
| Volume resistivity | 1 × 1015 | ohm-cm | At 25°C; test method not stated |
| Dielectric strength | 21.7 (550) | kV/mm (V/mil) | ASTM D149; specimen thickness not stated |
