COOLTHERM SC-6702
Harmonization Code : 3910.00.00.90 | Silicones in Primary Forms; Others
Main features
- 0.7 W/(m K) Silicone Encapsulation
- 4-Hour Working Life
- -55 to 260 deg C Material Use
Product Description
CoolTherm® SC-6702 Thermally Conductive Silicone Encapsulant is a two-component silicone system for thermally conductive encapsulation of sensitive electronic modules. The red resin and white hardener mix at a simple 1:1 ratio by weight or volume to form a red material with a typical 30,000 cP viscosity at 25°C, four-hour working life at 25°C, and 25-minute gel time at 66°C. The documented cure is 16–24 hours at 85°C. Typical cured properties include 0.7 W/m·K thermal conductivity, 65 Shore A hardness, 17.1 kV/mm dielectric strength, and an operating-temperature range from -55°C to 260°C.
Key features
- Two-component thermally conductive silicone encapsulant
- Simple 1:1 mix ratio by weight or volume
- 30,000 cP mixed viscosity for cartridge or meter/mix/dispense application
- Primerless adhesion in most applications, subject to substrate validation
- Typical 0.7 W/m·K thermal conductivity and 17.1 kV/mm dielectric strength
- Documented -55°C to 260°C material-use range
- UL 94 V-0 certified, subject to the current listed formulation and test construction
Applications
- Thermally conductive encapsulation of sensitive electronic modules
- Electrical and electronic assemblies requiring flexible silicone insulation
- High-voltage or critical assemblies using validated vacuum-assisted void control
- Modules exposed to broad operating temperatures within the documented material-use range
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Physical Properties
Thermal Properties
Mechanical Properties
Electrical Properties
Additional Information
CoolTherm® SC-6702 Thermally Conductive Silicone Encapsulant
A two-component silicone system designed to provide heat dissipation and electrical insulation when encapsulating sensitive electronic modules. The material combines a 1:1 mix ratio, moderate mixed viscosity, primerless adhesion positioning, flexible cured properties, and a broad documented material-use temperature range.
.png)
Component and mixed-material properties
Thoroughly premix each component before combining the red resin and white hardener at 1:1 by weight or volume.
| Property | SC-6702 resin | SC-6702 hardener | Mixed material |
|---|---|---|---|
| Appearance | Red liquid | White liquid | Red liquid |
| Viscosity at 25°C | 27,000 cP | 28,000 cP | 30,000 cP |
| Specific gravity | 2.15 | 2.04 | 2.09 |
| Mix ratio | 1:1 by weight or volume | ||
| Gel time at 66°C | 25 minutes | ||
| Working life at 25°C | 4 hours | ||
Premix both components, combine 1:1, minimise air, dispense, and heat cure
Mix the resin and hardener separately before combining them at 1:1 by weight or volume. Automatic meter/mix/dispense equipment may be used for higher-volume production.
- Use closed-chamber mechanical mixing where practical to reduce introduced air.
- For extremely high-voltage or other critical applications, evaluate vacuum processing to minimise bubbles and voids.
- Apply using handheld cartridges or automatic meter/mix/dispense equipment.
- Avoid surfaces containing cure-inhibiting amines, sulphur, or butyl-containing materials.
- When substrate compatibility is uncertain, apply a test patch and allow the normal cure time.
- Cure for 16–24 hours at 85°C after the material reaches the target temperature.
.png)
Restore both resin and hardener to a uniform state before metering.
Combine 1:1 by weight or volume and mix thoroughly.
Minimise voids and verify uncertain surfaces with a cured test patch.
Apply the validated fill pattern and hold at 85°C for 16–24 hours after reaching temperature.
Storage and industrial handling
Each component has a six-month shelf life when stored at temperatures up to 40°C in its original unopened container. Keep containers closed, upright, and in well-ventilated storage. The current hardener SDS classifies the material for suspected reproductive toxicity and aquatic hazards, while the resin SDS includes chronic methylpolysiloxane decomposition warnings. Both SDS documents note that formaldehyde may be generated at approximately 150°C and above in oxygen-containing atmospheres. Use trained industrial personnel, adequate ventilation, suitable gloves and eye protection, environmental controls, and current regional SDS and label instructions.
Thermal, mechanical, and electrical properties
The following values are typical cured-material results and are not lot specifications. Installed thermal and electrical performance also depends on geometry, thickness, coverage, interfaces, voids, cure, voltage design, and the surrounding assembly.
| Property | Typical value | Context |
|---|---|---|
| Thermal conductivity | 0.7 W/m·K | Hot Disc Transient Method, ISO 22007-2. |
| Coefficient of linear thermal expansion | 239 ppm/°C | ASTM C864. |
| Hardness | 65 Shore A | Flexible cured silicone. |
| Tensile strength | 4.1 MPa (600 psi) | ASTM D412 bulk-material property. |
| Elongation at break | 80% | ASTM D412. |
| Volume resistivity at 25°C | 1.7 × 1015 ohm-cm | ASTM D257; not a finished-assembly working-voltage rating. |
| Dielectric strength | 17.1 kV/mm (434 V/mil) | ASTM D149; breakdown property rather than design working voltage. |
| Dielectric constant | 5.5 at 1 MHz and 25°C | ASTM D150. |
| Dissipation factor | 0.014% at 1 MHz and 25°C | ASTM D150 as published in DS3567. |
Thermal encapsulation for sensitive electronic modules
SC-6702 is directly positioned for encapsulating sensitive electronic modules where heat dissipation, electrical insulation, flexible silicone properties, and broad-temperature capability are required. Final selection must consider component layout, fill depth, void tolerance, cure inhibition, voltage, creepage and clearance, thermal path, enclosure design, repairability, and environmental exposure.
.png)
.png)
.png)
Validate SC-6702 for your electronic encapsulation process
Krayden can help review mix-ratio control, component premixing, meter/mix/dispense equipment, vacuum processing, cure inhibition, fill geometry, void control, cure profile, thermal path, electrical insulation, operating temperature, UL scope, and assembly-level qualification for CoolTherm® SC-6702.
