COOLTHERM MG-122
Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg
Main features
- Single-Component No-Mix Dispensing
- Thermally Conductive Chip Interface
- Flip-Chip and BGA Application Fit
Product Description
CoolTherm MG-122 Thermally Conductive Gel is a one-component silicone thermal interface material for transferring heat from high-wattage electronic devices. The dispensable gel format avoids component mixing and is used around flip-chip microprocessors, PPGA, BGA, microBGA, DSP, and graphics accelerator devices. Its thermally conductive silicone composition supports interface filling where a soft gel is preferred over a rigid cured encapsulant. The product is supplied for controlled dispensing and stored under frozen conditions before use, supporting planned material conditioning in electronics assembly operations.
Key features
- Single-component dispensing: The gel is applied without resin-to-hardener mixing.
- Thermally conductive chip interface: The silicone gel supports heat transfer from high-wattage electronic components.
- Package-level application fit: Applications include flip-chip, PPGA, BGA, microBGA, DSP, and graphics accelerator devices.
Applications / Suitable for
- Flip-chip microprocessors
- PPGA, BGA, and microBGA packages
- DSP and graphics accelerator chips
- High-wattage electronic components
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Additional Information
As-supplied / before-processing properties
As-supplied characteristics for the one-component gel.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Components | One | component | No resin-to-hardener mixing step |
| Chemistry | Silicone | Thermally conductive gel | |
| Physical form | Dispensable gel | Controlled application to electronic interfaces | |
| Storage state | Frozen | Condition before use using the stated product procedure |
After-processing / final-state properties
Installed-state characteristics for the soft thermal interface gel.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Installed form | Soft gel interface | Non-structural thermal interface material | |
| Primary function | Heat-transfer interface | High-wattage electronic devices | |
| Interface behavior | Conforms to package-level gaps | Dispensable gel format | |
| Device scope | Flip-chip; PPGA; BGA; microBGA; DSP; graphics accelerators | Applications |
