COOLTHERM 6735

Harmonization Code : 3910.00.00.90 | Silicones in Primary Forms; Others

COOLTHERM 6735

Main features

  • Eight-Hour Working Window
  • 55 to 205 deg C Service Range
  • Reversion-Resistant Addition-Cure System

Product Description

Circalok™ 6735 Silicone Encapsulant is a clear, two-component, addition-cure silicone system for potting and encapsulation applications requiring a flexible cured material and high-temperature service. The mixed material has a typical 3,500 cP viscosity at 25°C, an eight-hour working life, and a 10:1 resin-to-hardener mix ratio by weight. It cures for 4 hours at 65°C, with an overnight post-cure at 85°C recommended for optimum properties, particularly in large volumes. Typical cured properties include 40 Shore A hardness, 750 psi tensile strength, 150% elongation at break, 450 V/mil dielectric strength, and operation from -55°C to +205°C.

Key features

  • Clear, two-part addition-cure silicone encapsulant
  • Low 3,500 cP mixed viscosity for flow around components and into cavities
  • Eight-hour working life at 25°C
  • Broad documented operating range from -55°C to +205°C
  • Typical volume resistivity of 1 × 1014 ohm-cm and dielectric strength of 450 V/mil
  • Adheres to most substrates without primer, subject to substrate validation
  • Reversion-resistant, non-corrosive high-temperature silicone system

Applications

  • Potting and encapsulation of electrical and electronic assemblies
  • High-temperature assemblies requiring a flexible silicone encapsulant
  • Large-volume or deep-section encapsulation using controlled heat cure and post-cure
Product Family

COOLTHERM 6735

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.

TDS, SDS & Technical Documents

Technical Specifications

General Properties
ColorColor
6735 A Resin: Clear Liquid | 6735 B Hardener: Clear Liquid | Mixed: Clear Liquid
Specific GravitySpecific Gravity
A: 1.00 | B: 1.00 | Mixed: 1.00
Physical Properties
Viscosity (Part A)Viscosity (Part A)
3700 mPa.s
Viscosity (Part B)Viscosity (Part B)
200 mPa.s
Mechanical Properties
ElongationElongation
150 %
Electrical Properties
Volume ResistivityVolume Resistivity
1 x 10^14 Ohms⋅cm
Thermal Properties
Thermal ConductivityThermal Conductivity
0.2 W/m.K

Additional Information

Addition-cure silicone encapsulant

Circalok™ 6735 Silicone Encapsulant

A clear, low-viscosity, two-component silicone system for potting and encapsulation where flexible electrical insulation and high-temperature operation are required. Circalok 6735 provides an eight-hour working life for meter/mix/dispense processing and cures to a 40 Shore A elastomer after controlled heat cure.

Clear silicone 3,500 cP mixed viscosity 8-hour working life -55°C to +205°C 40 Shore A
Circalok 6735 Silicone Encapsulant resin and hardener packaging

Circalok 6735 Silicone Encapsulant resin and hardener packaging

As supplied and mixed

Component and mixed-material properties

Both components and the mixed system are clear liquids. The resin provides the main viscosity, while the lower-viscosity hardener is incorporated at a controlled 10:1 ratio by weight. All values are typical.

Property 6735 A resin 6735 B hardener Mixed material
Appearance Clear liquid Clear liquid Clear liquid
Viscosity at 25°C 3,700 cP 200 cP 3,500 cP
Specific gravity 1.00 1.00 1.00
Working life at 25°C 8 hours after mixing
Processing

Stir, meter at 10:1, dispense, and heat cure

Thoroughly stir each component separately, then combine Circalok 6735 A resin and Circalok 6735 B hardener at 10:1 by weight. Apply using automatic meter/mix/dispense equipment. Keep the material away from surfaces containing cure-inhibiting amines, sulfur, or tin salts.

  • Where substrate compatibility is uncertain, apply a test patch and allow it to complete the normal cure.
  • Cure for 4 hours at 65°C after the material reaches the target temperature.
  • Allow for oven ramp rate and the thermal mass of parts and large encapsulated volumes.
  • An overnight post-cure at 85°C is recommended for optimum properties, especially for large volumes.
Process diagram for stirring, 10 to 1 mixing, meter mix dispensing and heat curing Circalok 6735

Process visual showing automated dispensing, 4-hour cure at 65°C, and optional overnight post-cure at 85°C.

1. Stir separately

Restore each component to a uniform state before combining.

2. Mix 10:1 by weight

Control the resin-to-hardener ratio and mix thoroughly without unnecessary air entrainment.

3. Meter and dispense

Apply within the eight-hour working life using validated meter/mix/dispense equipment.

4. Cure and post-cure

Cure 4 hours at 65°C; use the recommended overnight 85°C post-cure where optimum properties are required.

Storage and handling

Each component has a six-month shelf life from the date of manufacture when stored at 25°C in its original, unopened container. Before handling, review the current product label and applicable safety documentation. Circalok 6735 is for trained industrial or commercial personnel and is not intended for household or consumer use.

Final cured state

Mechanical, thermal, and electrical properties

The cured values below are typical laboratory properties. The datasheet identifies a 2-hour cure at 150°C for the cured-property specimen, so these values should not be assumed to represent every 65°C production cure without validation.

Property Typical value Context
Hardness 40 Shore A Flexible cured elastomer.
Tensile strength 750 psi Bulk tensile property.
Elongation at break 150% Bulk tensile specimen property.
Thermal conductivity 0.2 W/m·K Bulk cured-material property; the product is not positioned as a thermally conductive encapsulant.
Volume resistivity at 25°C 1 × 1014 ohm-cm ASTM D257.
Dielectric strength 450 V/mil Test property, not an assembled-system working-voltage rating.
Dielectric constant 3.0 at 100 Hz Frequency-specific bulk property.
Dissipation factor 0.001 at 100 Hz Frequency-specific bulk property.
Applications

Flexible, high-temperature electrical and electronic encapsulation

Circalok 6735 is positioned within Parker’s electronic potting and encapsulation portfolio for assemblies requiring a clear, flexible silicone and high-temperature operation. Validate cure compatibility, adhesion, section size, electrical design, and environmental exposure in the complete assembly.

Electrical or electronic assembly encapsulated in clear silicone

Electrical and electronic potting

Suitable for filling around electrical and electronic components where a flexible dielectric encapsulant is required.

High-temperature assemblies

May be evaluated for devices operating within the documented -55°C to +205°C range, subject to complete assembly validation.

Large-volume encapsulation

The low mixed viscosity and recommended 85°C post-cure support evaluation in larger encapsulated volumes where cure uniformity must be controlled.

Evaluate Circalok™ 6735 for your encapsulation process

Krayden can help review component compatibility, cure-inhibition risk, section volume, metering and dispensing, cure and post-cure profiles, adhesion, dielectric requirements, and high-temperature validation for Circalok™ 6735.

Contact Krayden Technical Support

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