CNP OM5300

ALPHA OM-5300 Solder Paste is a no-clean tin-lead solder paste for surface-mount assembly that includes lead-free component finishes. The product provides a tin-lead soldering option for mixed-technology production where lead-free components are assembled on the same circuit board. Its no-clean flux system fits processes that do not include a separate post-reflow cleaning step. The product is supplied in alloy, powder, metal-load and package options for different reflow requirements in production.

Key features

• Mixed-Technology Soldering: fits tin-lead assembly processes that include lead-free component finishes
• No-Clean Flux System: is used in surface-mount processes without a separate post-reflow cleaning step
• Configurable Process Format: offers alloy, powder, metal-load and package options for different reflow requirements

Applications

Tin-lead surface-mount assembly processes that include lead-free component finishes.